Apparatus and method for temperature self-adaptive control fan

Abstract

The invention discloses a self-adapting temperature controlled fan device and a method thereof. The method includes that working temperature in a plurality of network elements in equipment is regularly collected and the maximum temperature of the equipment is found out; the maximum temperature value of the current equipment is judged, if the maximum temperature value falls into the range of the upper limit and the lower limit of the system temperature, the current maximum temperature value of the equipment and the previous recorded maximum temperature value are compared and the difference is obtained; if the absolute value of the difference is judged to be larger than a defined threshold, the adjustment and control of the rotation speed are conducted to the fan in the fan system. By applying the self-adapting temperature controlled fan device of the invention and the regular collecting of the maximum temperature of the equipment as the input of the temperature self-adaptation, the best suitable fan revolution rate of each fan at the current temperature can be obtained and the optimal control of the fan revolution rate is realized, thus realizing the aims of reducing power consumption and increasing the stability of the system.

Description

technical field [0001] The invention relates to temperature control technology, in particular to a device and method for temperature self-adaptive control of a fan. Background technique [0002] At present, the equipment in the communication room is developing towards miniaturization, and the density of single boards is also getting higher and higher. Because the board will generate a certain amount of heat during operation, especially the service board with high power consumption, if the heat dissipation is not handled in time, the temperature will be too high, and the chip temperature on the board will exceed its normal temperature range, affecting the board. performance. To ensure the normal operation of the board, the temperature of the device needs to be controlled. [0003] At present, the fan of the device mainly controls the speed of the fan by adopting pulse-width modulation (PWM, Pulse-Width Modulation) to control the speed of the fan. Specific working principle...

AI Technical Summary

Problems solved by technology

[0006] 1. The device temperature is only the ambient temperature of the device or the working temperature of a certain network element. This temperature is not necessarily the highest temperature among all the boards of the device, which may cause the fan output speed to be lower than the target speed;

[0007] 2. Each fan cannot be controlled independently, and the control method is very inflexible;

[0008] 3. The mapping relationship between device temperature and fan status lacks the support of experimental data

However, the mapping relationship between a specific temperature range of the device and the fan status is not supported by experimental data and is not operable;

[0009] To sum up, based on the existing temperature feedback control fan system, the temperature may not be the highest temperature of the device system, and the best heat dissipation effect may not be achieved in a short period of time; multiple fans cannot be controlled independently; the temperature of the device and the heat dissipation intensity of the fan The corresponding relationship only has a theoretical basis and is not operable, so a new technical solution for temperature adaptive control of fans is needed to solve the above problems

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