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Piezoelectricity composite material and preparation method thereof

A piezoelectric composite material and piezoelectric material technology, applied in the field of multilayer piezoelectric composite materials and their preparation, can solve the inaccurate mutual alignment of adjacent layers, structural defects of multilayer 1-3 piezoelectric composite materials, etc. problem, achieve the effect of saving processing time and cost, and simple processing technology

Active Publication Date: 2008-11-12
汉摩尼(江苏)光电科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0008] The technical problem to be solved by the present invention is that due to the structural defects of the multi-layer 1-3 piezoelectric composite material, in the manufacturing process, the mutual alignment of adjacent layers is inaccurate.

Method used

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  • Piezoelectricity composite material and preparation method thereof
  • Piezoelectricity composite material and preparation method thereof
  • Piezoelectricity composite material and preparation method thereof

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Embodiment Construction

[0029] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] Aiming at the problem of mutual alignment of adjacent layers in the manufacturing process of a multilayer ultrasonic transducer using 1-3 type piezoelectric composite materials, the invention proposes a new type of multilayer 3-1 type piezoelectric composite material that is easier to process. Piezoelectric composite material; the piezoelectric composite material can replace 1-3 piezoelectric composite materials to manufacture multi-layer ultrasonic transducers, avoiding and solving the problem of mutual alignment of adjacent layers.

[0031] The invention provides a kind of 3-1 type multilayer piezoelectric composite material, comprising: the frame formed after cutting and the viscosity not greater than 80Pas ( 8000 centipoise, namely 8000 centipoise) piezoelectric composite material combined with low viscosity epoxy resin adhesive. ...

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PUM

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Abstract

The invention discloses a piezoelectric composite material and a preparation method thereof. The piezoelectric composite material comprises filling material and at least two layers of piezoelectric materials; based on the polarity of the piezoelectric materials in each layer, the piezoelectric materials in adjacent layers are arranged in reverse; the piezoelectric materials in each layer are arranged with three-dimensional communication; the filling material is arranged with one-dimensional communication; work face electrodes are respectively arranged on each work face of the piezoelectric composite material; in the section parallel to the work face of the piezoelectric composite material, the piezoelectric materials are communicated and arranged in the form of regular strip combination; the filling material is arranged in isolation. The product of the invention can be used for manufacturing multi-layer ultrasonic transducers and sensors, avoiding and solving the problem of inaccurate positioning of adjacent layers; besides, the process flow is simple with only two piezoelectric single-crystal cutting directions, thus saving processing time and cost.

Description

technical field [0001] The invention relates to a piezoelectric composite material, in particular to a multilayer piezoelectric composite material and a preparation method thereof. Background technique [0002] Ultrasonic transducers are widely used in biomedical imaging, diagnosis and treatment, industrial non-destructive testing (flaw detection), and underwater sonar. Ultrasonic transducers usually use piezoelectric materials with piezoelectric effect, which can convert mechanical energy into electrical energy, or convert electrical energy into mechanical energy. Piezoelectric ultrasonic transducers can take the form of a single layer or a multilayer. The multi-layer piezoelectric ultrasonic transducer adopts the opposite polarization direction of adjacent layers, and the layers are combined by means of series connection of mechanical structure and parallel connection of circuit structure. Compared with a single-layer structure of the same thickness, a multilayer piezoel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/08H01L41/18H01L41/22B06B1/06G01S7/521H10N30/00H10N30/057H10N30/85
Inventor 吴正斌黄沙徐国卿
Owner 汉摩尼(江苏)光电科技有限公司
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