Method for producing printed circuit board

A technology of printed circuit boards and production methods, applied in the direction of multi-layer circuit manufacturing, etc., to achieve the effects of stable product performance, weight reduction, and reliable connection

Inactive Publication Date: 2008-11-12
深圳松维电子股份有限公司
View PDF0 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Many existing flexible board factories and hard board factories regard rigid-flex boards as an expansion direction, but few manufacturers can successfully mass-produce them, and most of them are in R&D or small-batch production.
There are still some technical problems that have not b

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for producing printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The core idea of ​​the present invention: By adopting the copper glue through-hole method and the process sequence of "etching the circuit first, then drilling the through-hole", the product performance is more stable, and it is more suitable for the large-scale production and manufacture of multi-layer printed circuit boards.

[0023] In order to facilitate a further understanding of the present invention, the present invention will now be described in detail in conjunction with the accompanying drawings and specific embodiments.

[0024] see figure 1 As shown: the production process or main steps of the multi-layer printed circuit board used in the present invention are: firstly, the flexible board is made partly-cutting the material according to the required size, and then the inner layer circuit is made and carried out according to the drawing. Blackening treatment, and then pressing treatment, after the completion of the above, drill via holes according to the requ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for manufacturing a printed circuit board that comprises procedures as following: a. An inner flexible board carries out the procedures of making inner circuit, drilling via-hole and performing lamination treatment; b. an inner base board etched with a circuit and resin material carry out lamellar lamination build-up to acquire a multi-layer base board; c. The multi-layer base board carries out the procedures of opening the joint window of a flexible board by CNC and treating surface of the multi-layer base board; and then performing lamination of a rigid-flex board; d. The via-hole of a rigid board is drilled and the outer surface of the multi-layer base board is etched with the circuit to obtain a multi-layer printed circuit board. As the invention adopts a copper adhesive via-hole method, the cooper conductive adhesive adopted by the via-hole does not cause 'sliver displacement' that silver paste may result in. What is more, as the copper conductive adhesive is poured into the via-hole for electric connection by adopting a printed via-hole method, production efficiency is greatly improved. As processing sequence that circuit is etched first and then the via-hole is drilled is adopted, product performance is more stable. Therefore, the method is applicable to the scale production and manufacture of the multi-layer printed circuit board.

Description

technical field [0001] The invention relates to the technical field of production methods of printed circuit boards, in particular to a production method of rigid-flexible printed circuit boards. Background technique [0002] Rigid-flex boards are widely used in mobile phones, digital cameras, automobiles, instrumentation, medical machinery, PCs, and other fields. Rigid-flexible boards can be used in at least three places on the mobile phone: the connection between the LCD screen and the host, the connection between the image sensor module and the off-machine, and the folding part of the mobile phone; at the same time, the rigid-flexible board has the advantages of easy installation, effective use of installation space, and high density. , Fine pitch, small size, light weight, and strong reliability, cost saving and so on. [0003] Rigid-flexible board refers to a printed board that contains one or more rigid areas and one or more flexible areas. It is composed of rigid boa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/46
Inventor 郭明华宋文学
Owner 深圳松维电子股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap