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A mems capacitor microphone, a method of manufacturing a mems capacitor microphone, a stack of foils, an electronic device and use of the electronic device

A technology of electronic equipment, microphone

Inactive Publication Date: 2011-12-07
KNOWLES ELECTRONICS ASIA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Silicon processing of solid capacitors and microphone devices is complex and expensive

Method used

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  • A mems capacitor microphone, a method of manufacturing a mems capacitor microphone, a stack of foils, an electronic device and use of the electronic device
  • A mems capacitor microphone, a method of manufacturing a mems capacitor microphone, a stack of foils, an electronic device and use of the electronic device
  • A mems capacitor microphone, a method of manufacturing a mems capacitor microphone, a stack of foils, an electronic device and use of the electronic device

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Embodiment Construction

[0058] Hereinafter, a detailed description of the present invention will be given. As previously described, the present invention relates to a method of manufacturing a MEMS capacitor microphone as well as to such a MEMS capacitor microphone itself. The method of fabricating a MEMS capacitor microphone consists of several sub-steps:

[0059] - applying a conductive layer to at least one face of the foil (so both faces are also possible, and in some cases even preferred);

[0060] - Pretreatment of the foil;

[0061] - stacking foils, thus forming a MEMS capacitor microphone;

[0062] - adhesive foil; and

[0063] - Separation of the MEMS capacitor microphone from the foil stack.

[0064] The pretreatment of the foil consists of selected following steps:

[0065] - Leave the conductive layer and foil intact;

[0066] - remove the conductive layer to expose the foil;

[0067] - removing the conductive layer and part of the foil so that a thinner foil remains; or

[0068]...

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Abstract

The invention relates to a method of manufacturing a MEMS capacitor microphone and further to such MEMS capacitor microphone. With the method a MEMS capacitor microphone can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a,11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the MEMS capacitor microphones are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities and membranes. This opens up the possibility of manufacturing MEMS capacitor microphone.

Description

technical field [0001] The invention relates to a method of manufacturing a MEMS capacitor microphone with spacing. The invention also relates to such a MEMS capacitor microphone. The invention also relates to a foil stack comprising such a MEMS capacitor microphone according to the invention. The invention also relates to an electronic device comprising a MEMS capacitor microphone according to the invention. The invention also relates to the use of such electronic devices. Background technique [0002] US5490220 discloses a solid capacitor and microphone device and a method of manufacturing such a device. The method includes several deposition and patterning steps for the processing of functional conducting and insulating layers on planar silicon wafers. Furthermore, backside etching of the silicon wafer is required in order to disconnect the diaphragm of the capacitor or microphone device, which includes one electrode of the capacitor or microphone device. Finally the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C99/00
CPCB81C1/00119F16K2099/008B01L2200/10F16K99/0051B01L2300/0627B01L3/502707F16K99/0007B01L2300/0887B01L2300/123B81C1/00182B81C2201/019B01L2400/0638F16K99/0001F16K99/0034F04B43/043F16K2099/0084B01L2300/0819B01L3/502738F16K99/0015B01L2300/1827B81C99/0095B01L2200/12B81B2201/0257H04R19/04H04R31/00Y10T428/24851
Inventor 格特·兰格雷斯约翰尼斯·威廉姆斯·维坎普雅各布斯·伯纳德斯·佳伯斯
Owner KNOWLES ELECTRONICS ASIA
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