Pin shaping apparatus for integrated circuit and pin shaping method

Abstract

An integrated circuit pin shaping device and a pin shaping method belong to the semi conductor device processing technical field, wherein the device comprises a base provided with a door type frame, the base under the door type frame is provided with a guide pillar and an upper module block capable of longitudinally moving along the guide pillar, the door type frame is provided with a first eccentric wheel unit capable of longitudinally moving the upper module block, the base under the door type frame is provided with a slide way, a lower module block capable of transversely moving along the slide way and a second eccentric wheel unit capable of transversely moving the lower module block, one end of the slide way is provided with a stop block. The upper and lower module blocks are detachably provided to make the correction of the pins simple and accurate, thereby satisfying the user demands and reducing price, production/maintenance cost. The corrected integrated circuit can pass the check of automatic checking devices and is applicable in patch production. The invention has wide application in the pin shaping of various integrated circuits and the preprocessing technical field of patch production.

Description

technical field [0001] The invention belongs to the field of methods or equipment for manufacturing or processing semiconductor or solid devices or parts thereof, and in particular relates to a device and a correction method for correcting packaged integrated circuit pins with defective pins. Background technique [0002] After the integrated circuit chip (abbreviated as integrated circuit, the same below) is packaged, the integrated circuit will be soldered or pasted on the circuit board (commonly known as PCB board) as a chip component. Among them, the pins of the integrated circuit (also called pins, the same below) serve as a bridge connecting the internal circuit of the integrated circuit with the circuit board circuit, and have extremely strict requirements on its size. There are many types of integrated circuits, and some have fewer pins, which are relatively easy to handle; however, some integrated circuits have many and dense pins, and the distance between the pins ...

AI Technical Summary

Problems solved by technology

The work efficiency of the whole device is high, and it is suitable for the operation line of mass production, but it has the disadvantages of complex structure and high manufacturing / purchase cost. Similarly, the integrated circuit after its whole pin can only be used for insertion PCB board production process and cannot be used for patch production process

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