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Neural network methods and apparatuses for monitoring substrate processing

A neural network and substrate processing system technology, applied in the field of neural network monitoring methods and equipment for substrate processing

Inactive Publication Date: 2008-11-26
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Some of the issues associated with this technique can include difficulty handling changes in process regimes and meeting varying depth requirements

Method used

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  • Neural network methods and apparatuses for monitoring substrate processing
  • Neural network methods and apparatuses for monitoring substrate processing
  • Neural network methods and apparatuses for monitoring substrate processing

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Embodiment Construction

[0014] Embodiments of the present invention provide spectroscopic analysis that can be used to monitor a fabricated integrated circuit on a semiconductor substrate (such as a silicon substrate, a silicon-on-insulator (SOI) substrate, etc.), a flat panel display, a solar panel, or other electronic devices. The method and equipment of the process of the device. For example, in one embodiment, a method may train a substrate by using as training data substrate state information derived from reflected signals collected at a specified region of the substrate with combined process and other relevant data. neural network to provide process control. The method uses structure-related measurement data (i.e., substrate state information) at the pre-etch, during-etch, and post-etch stages of a processing step to train a neural network (e.g., a multilayer perceptron network) to adjust process time and control the substrate. Handle the operating condition of the device. For example, the me...

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Abstract

Aspects of the present invention include methods and apparatuses that may be used for monitoring substrate processing systems. One embodiment may provide an apparatus for obtaining in-situ data regarding processing of a substrate in a substrate processing chamber, comprising a data collecting assembly for acquiring training data related to a substrate disposed in a processing chamber, an electromagnetic radiation source, at least one in-situ metrology module to provide measurement data, and a computer, wherein the computer includes a neural network software, wherein the neural network software is adapted to model a relationship between the plurality of the training and other data related to substrate processing.

Description

technical field [0001] The present invention broadly relates to methods and apparatus for substrate processing. More specifically, the present invention relates to neural network monitoring methods and apparatus for substrate processing, such as etching processes, deposition processes, or other processes. Background technique [0002] Integrated circuits have evolved into complex devices that can include millions of components such as transistors, capacitors, resistors, and the like on a single chip. The evolution of chip design continues to demand faster circuits and higher circuit densities. Demands for higher circuit densities necessitate reductions in the dimensions of integrated circuit components. The minimum dimensions of these device features are generally referred to in the art as critical dimensions. Critical dimensions generally include the minimum width of features such as lines, rows, openings, line spacing, and the like. [0003] As these critical dimension...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F19/00G05B13/00
CPCH01L22/12G01B11/0625
Inventor 雷·利安维维恩·常马修·芬顿·戴维斯昆廷·E·沃克
Owner APPLIED MATERIALS INC