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Remelting plating Sn material and electronic component using the same

A technology of electronic components and coatings, which is applied in the field of remelting and plating Sn materials, can solve the problems of reduced solderability, etc., and achieve the effects of low insertion and extraction force, less deterioration of solderability and contact resistance

Active Publication Date: 2008-12-10
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is also described that if the thickness of the Sn layer is 0.5 μm or less, the solderability will be reduced.

Method used

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  • Remelting plating Sn material and electronic component using the same
  • Remelting plating Sn material and electronic component using the same
  • Remelting plating Sn material and electronic component using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0067] Examples of the present invention will be described below, but these Examples are for illustrative purposes only and are not intended to limit the present invention.

[0068] 1. Measurement method of each characteristic

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PUM

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Abstract

The invention provides a plating Sn material which keeps favorable weldability and low contact resistance even exposed in a high temperature environment and has low plug performance. The plating Sn material is provided with a bottom Ni plating layer, a middle Sn-Cu plating layer and a surface Sn plating layer in sequence on the surface of a copper or a copper alloy, wherein the bottom Ni plating layer is composed of Ni or Ni alloy, the middle Sn-Cu plating layer is composed of an Sn-Cu series alloy with an Sn-Cu-Zn alloy layer at least at one side adjacent to the surface Sn plating layer, and the surface Sn plating layer is composed of Sn alloy with 5-1000 weight ppm of Zn.

Description

technical field [0001] The present invention relates to a remelted Sn material obtained by remelting Sn on the surface of copper or copper alloy. The present invention also relates to electronic components such as connectors, terminals, switches, and lead frames using the plating material. Background technique [0002] Generally, in electronic components such as connectors and terminals used in various electronic equipment such as automobiles, home appliances, and OA equipment, copper or copper alloys are used as base materials to improve their rust resistance, corrosion resistance, and electrical properties. The function is plated. Plating treatments include Au, Ag, Cu, Sn, Ni, solder and Pd, etc., especially Sn-plated materials coated with Sn or Sn alloys. From the perspective of cost, contact reliability and weldability, they are mostly used in connectors, Terminals, switches and outer lead parts of lead frames, etc. [0003] Among Sn-plated materials, remelted Sn-plat...

Claims

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Application Information

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IPC IPC(8): B32B15/01C23C30/00C23C10/00C23C10/02
Inventor 儿玉笃志田中幸一郎
Owner JX NIPPON MINING & METALS CO LTD
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