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Hot pressing mechanism

A technology of hot-pressing mechanism and heat insulating material, which is applied in presses, optics, instruments, etc., can solve the problems of poor heating efficiency of hot-pressing mechanism and damage to substrates.

Inactive Publication Date: 2008-12-10
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of this, the purpose of the present invention is to provide a hot pressing mechanism that can isolate heat radiation and avoid the problem of poor heating efficiency of the hot pressing mechanism caused by air cooling the substrate
The heat insulation material insulates the hot pressing head and transfers heat to the non-hot pressing area by means of heat radiation and heat convection, avoiding the problem of damage to the hot-pressed substrate due to high temperature during the hot-pressing process

Method used

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Embodiment Construction

[0034] like figure 2 , Figure 3A and Figure 3B Shown is a heat-pressing mechanism disclosed in the first embodiment of the present invention, including: a heat-pressing head 10 , a heat insulating material 20 , a heating platform 30 and a transmission device 40 . The heating platform 30 is placed on the ground as a main supporting structure. The transmission device 40 is connected to the heating platform 30 to drive the thermal pressing head 10 to move so as to change the position of the thermal pressing head 10 on the heating platform 30 .

[0035] see Figure 3A and Figure 3B , the thermal pressing head 10 has a pressing surface 11 and a side wall 12 , wherein the side wall 12 is adjacent to the pressing surface 11 and surrounds the edge of the pressing surface 11 . The thermal pressing head 10 is used to generate high temperature after being heated, and the pressing surface 11 contacts the solder or the welding piece to be hot-pressed, so as to heat the solder or t...

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Abstract

A hot-press mechanism comprises a hot-press head and a heat insulator; wherein, the hot-press head is provided with a press surface and a side wall which is abutted with the press surface; the heat insulator is covered on the side wall, the range of the heat transfer coefficient of the heat insulator is from 0.13*10-2W / m-K to 2.00 W / m-K, and the heat transfer coefficient of the hot-press head is larger than that of the heat insulator. During the hot press, the heat insulator can reduce the heat which is transferred to a non-hot-press area by the hot-press head through the heat radiation and the heat convection ways to avoid the base plate damage which is caused by high temperature.

Description

【Technical field】 [0001] The invention relates to a heat-pressing mechanism, in particular to a heat-pressing mechanism in which heat-insulating materials are coated on the side wall of a heat-pressing head. 【Background technique】 [0002] In the existing liquid crystal panel, the electronic chip and the liquid crystal panel are bonded by thermocompression through a thermocompression mechanism. Please refer to figure 1 , the existing heat pressing mechanism includes a heat pressing head 10 and a clamp 43 , wherein the heat pressing head 10 has a pressing surface 11 and a side wall 12 . The heat-pressing head 10 is made of high heat-conducting materials such as stainless steel or high-heat-conducting ceramics, so that the heat-pressing head 10 can be rapidly heated to the working temperature. [0003] During the hot pressing process, the hot pressing head 10 is heated to the working temperature, which is about 230°C to 450°C. Then press the parts to be pressed on the subst...

Claims

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Application Information

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IPC IPC(8): G02F1/13G02F1/1333B30B15/06B30B15/34
Inventor 王健发陈文钧陈明晖
Owner AU OPTRONICS CORP
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