System and method for testing carrier plate and integrated circuit element

Abstract

The invention discloses a test board with a ZIF connector, comprising a test substrate, a plurality of ZIF connectors and a plurality of locking components which can be adjusted in a dismountable way. The test substrate is provided with a first surface, a second surface and a plurality of groups of first through holes which vertically pass through the first surface and the second surface of the substrate; the two sides of a plurality of groups of first through holes on the first surface are provided with first electric joints which are arranged in pairs. A plurality of second electric joints are arranged on the second surface of the test substrate and are electrically conductive to the first electric joints. A plurality of ZIF connectors are arranged on the first surface of the test substrate; each ZIF connector is provided with a plurality of parallel second through holes which pass through the top surface of the ZIF connector to the bottom surface; the bottom of each ZIF connector is provided with electric terminals which are arranged in pairs and used for being correspondingly contacted with the first electric joints of the test substrate.

Description

technical field [0001] The invention relates to a test carrier board and a test system for testing integrated circuit components, in particular to an assembly method of the test carrier board and the test system with a ZIF connector therein. Background technique [0002] Generally, when an integrated circuit component is subjected to a final test, the electrical contacts or pins of the integrated circuit component need to be pressed together with the probes (Pogo Pins) in the test socket (Socket). Therefore, the test signal can be transmitted to the tester through the probe (Pogo Pin) to determine whether the integrated circuit element is good or bad. Please refer to Figure 1A , is a schematic diagram of a test carrier board used for testing integrated circuit components. The control system 10 sends a test signal, which is transmitted to a test head (generally referred to as a tester in the industry) 12 through a cable 11. The test head 12 has a motherboard (motherboard) 1...

AI Technical Summary

Problems solved by technology

The structure of the test carrier board 19 is quite complicated, generally composed of multi-layer boards, and the distance between the solder joints (pads) on it is very small. It must be processed by semiconductor-level manufacturing processes, and the cost is very expensive.

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