ZIF connector pin measuring card, its assembly method, wafer testing system and its testing method

Abstract

The invention discloses a needle-testing card assembly with a detachable adjustable ZIF connector, mainly comprising a needle-testing basal plate, a plurality of ZIF connectors and a plurality of detachable adjustable locking elements, wherein, the needle-testing basal plate in a disc plate shape is provided with a first surface, a second surface and multi-group of first through holes vertically passing through the first surface and the second surface of the basal plate; the multi-groups of the first through holes face the center of the needle-testing basal plate and are in circular arrangement; the multi-group of first through holes of the first surface have both sides provided with first electric contacts arranged in pairs; a plurality of needle-testing terminals are protruded on the second surface of the needle-testing basal plate for contacting a wafer and testing electrical signals; the plurality of ZIF connectors face the center of the needle-testing basal plate and are circularly arranged on the first surface of the needle-testing basal plate; each ZIF connector is provided with a plurality of parallel second through holes which pass the ZIF connector from the top surface to the bottom surface; the bottom of each ZIF connector is provided with paired electric terminals for correspondingly contacting the first electric contacts; the plurality of detachable adjustable locking elements pass through the first through holes and the second through holes and fixedly lock the ZIF connectors on the first surface of the needle-testing basal plate.

Description

technical field [0001] The invention relates to a probe test card and testing equipment for wafer testing, in particular to a probe test card structure with a ZIF connector and an assembly method for the probe test card. Background technique [0002] Along with the semiconductor wafer manufacturing process, in order to test the good and bad of the die on the wafer before the wafer is cut, it is necessary to use a high-performance probe card (probe card) to perform wafer testing, as in the patent No. It is disclosed by US Patent No. US6292005 and Taiwan Patent No. TW460703. The needle test card has a precise contact mechanism, which is used to make contact with the wafer to be tested, conduct the circuit, and perform electrical tests. [0003] Please refer to Figure 1A , is a schematic diagram of the wafer testing system. The control system 10 sends a test signal and transmits it to the test head (generally referred to as a tester in the industry) 12. The test head 12 has ...

AI Technical Summary

Problems solved by technology

The probe card 19 has a rather complex structure, generally composed of multi-layer boards (multi-layer), usually up to more than twelve layers, and the pads on it are very small in distance, and must be processed by semiconductor-level manufacturing processes. done, very expensive

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