Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

Abstract

This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (''CSPs''), ball grid arrays (''BGAs''), land grid arrays (''LGAs'') and the like, each of which having a semiconductor chip, such as large scale integration (''LSI''), on a carrier substrate. Similarly, the compositions are useful for mouting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (''snap cure underfills''), the inventive compositions possess an exotherm under 300 J / g or demonstrate package stability at 55 DEG C for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportion authorities, such as the U.S. Department of Transportation, to permit such air transport. The inventive compositions possess an exotherm under 300 J / g and / or demonstrate package stability at 55 DEG C for 7 days and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Description

technical field [0001] The present invention relates to semiconductor devices suitable for mounting on circuit boards, such as chip size or chip scale packages ("CSP"), ball arrays ("BGA"), landgrid array ("LGA") ) and the like, each of which has a semiconductor chip on a carrier substrate, such as a large scale integrated circuit ("LSI"). Similarly, the composition can be used to mount semiconductor chips themselves on circuit boards. When subjected to suitable conditions, the reaction products of the compositions of the present invention are controllably operable. Importantly, unlike many commercial fast cure underfill sealants ("snap cure underfill"), the compositions of the present invention have an exotherm below 300 Joules / gram, or demonstrate The packaging is stable for 7 days at 55°C, so no special packaging is required for delivery by air courier, or special approval from international shipping authorities, such as the US Bureau of Transportation, to allow such air ...

AI Technical Summary

Problems solved by technology

However, some physical properties of Product No.3593, such as crack resistance and moisture absorption may still need improvement

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