Polishing head for chemico-mechanical polishing

A technology of chemical machinery and polishing head, which is applied in the direction of surface polishing machine tools, grinding/polishing equipment, grinding heads, etc., which can solve the problems of poor mechanical properties and achieve the effect of improving the planarization effect

Inactive Publication Date: 2009-01-14
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the porous structure of low-k materials makes its mechanical properties very poor. The conventional downforce (2.0-6.0psi) in the CMP process can no longer meet the requirements, and low downforce (<2.0psi) must be used, which requires the polishing head Make corresponding improvements

Method used

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  • Polishing head for chemico-mechanical polishing
  • Polishing head for chemico-mechanical polishing
  • Polishing head for chemico-mechanical polishing

Examples

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Embodiment Construction

[0029] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0030] 1 and 2 are schematic cross-sectional structural views of a polishing head 100 according to a preferred embodiment of the present invention. The polishing head 100 includes an upper shell 10 , a base 20 , a retaining ring diaphragm 30 , a retaining ring 40 and a multi-chamber diaphragm 50 .

[0031] The upper housing 10 can be connected with a driving shaft, and the driving shaft drives the wafer 200 to rotate along the axis 90 in a fixed direction during the polishing process. The driving shaft is perpendicular to the polishing pad 300 during the polishing process. The upper casing 10 is cylindrical, and its outer diameter is about 250mm for a 200mm wafer, and ab...

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Abstract

The present invention discloses a polishing head used for chemical mechanical polishing. The polishing head comprises a pedestal with an annular groove at the underside edge area, a retaining ring membrane which is fixed under the pedestal and forms a retaining ring chamber with the annular groove, a retaining ring which is floated under the retaining ring chamber by the retaining chamber membrane which is provided with a bag area which is arranged just under the pedestal and is used for containing a wafer, and a multiple-chamber membrane which is provided with a circular plane and is assembled with a plurality of concentric annular ribs. The circular plan, the concentric annular ribs and the lower surface of the pedestal form a plurality of mutually independent concentric annular chambers. During the polishing process, the polishing head can apply different lower pressures on different areas at the back of the wafer by the concentric annular chambers, so as to obtain good uniformity.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a polishing head for chemical mechanical polishing. Background technique [0002] In the manufacturing process of integrated circuits, due to the continuous reduction of feature size and the continuous increase of the number of metal interconnection layers, the depth of focus of pattern exposure becomes smaller and smaller. To realize multi-layer wiring, the surface of the wafer must have high uniformity, and CMP (Chemical-Mechanical Polish, chemical mechanical polishing) technology is currently the most effective global planarization technology. [0003] CMP technology is to hold the wafer to be polished by the polishing head and press it on the polishing pad with a certain pressure. During the polishing process, the polishing head drives the wafer to rotate along the rotation axis, and the polishing pad rotates along the other rotation axis. The polish...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/047H01L21/304
Inventor 路新春王同庆朱煜雒建斌
Owner TSINGHUA UNIV
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