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Line forming method adopting printing means

A technology of circuit and means, applied in the direction of conductive pattern formation, can solve the problem of difficult to improve conductivity, and achieve the effect of no pollution and precise production

Inactive Publication Date: 2010-06-16
何建汉 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conductive adhesive is a colloid doped with metal particles in the colloid, not entirely composed of conductive substances, making it difficult to improve its conductivity, and most of them can only be used to electrically connect circuits, electronic components, etc.

Method used

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  • Line forming method adopting printing means
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  • Line forming method adopting printing means

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Experimental program
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Embodiment Construction

[0023] see Figure 1A-1D , Figure 1A-1D It is a schematic diagram of the circuit forming method using printing means in the present invention. Such as Figure 1A-1D As shown, the present invention mainly does not use etched copper foil to form lines, but uses such as Figure 1D The adhesive layer 16 shown adheres the metal powder and solidifies the metal powder to form the circuit 18 , so as to provide the convenience of coating like the conductive adhesive, but better than the conductive effect of the conductive adhesive.

[0024] In simple terms, the present invention is as follows Figure 1A A patterned screen 10 (having a traversing pattern 12 relative to a predetermined line), a substrate 14 is provided as shown, and as shown in FIG. Figure 1B As shown, the patterned screen 10 is used to transfer the adhesive to the substrate 14, and a patterned adhesive layer 16 is formed on the substrate 14, as shown in FIG. Figure 1C shown. Then, apply metal powder to the adhesiv...

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Abstract

The invention discloses a circuit forming method adopting printing means, which is mainly characterized in forming circuit by adhering metal powder by adhesion agent and solidifying the metal powder instead of etching copper foil. The method comprises: providing a patterned web plate (having cross pattern relative to scheduled circuit); transfer printing the adhesion agent on to the basis materialutilizing the patterned web plate to form a patterned adhesive layer on the base material; laying metal powder towards the adhesive layer to make the metal powder adhered on the adhesive layer; solidifying the metal powder to form circuit.

Description

technical field [0001] The invention relates to a method for forming a circuit, in particular to a method for forming a circuit by means of printing. Background technique [0002] According to the circuit design, the printed circuit board draws the electrical wiring connecting the circuit parts into a wiring pattern, and then reproduces the electrical conductor on the insulator according to the mechanical processing and surface treatment specified by the design. In the prior art, the copper foil layer is first pasted on the insulating substrate on the printed circuit board, and then a predetermined pattern (such as circuit, alignment hole, mark, etc.) is formed by using procedures such as development and etching. [0003] However, as environmental protection and other requirements become increasingly stringent, high-pollution chemical etching must be combined with sewage treatment and other means to treat the sewage generated in the process, resulting in additional cost burd...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12
Inventor 何建汉何彦鋕
Owner 何建汉
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