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Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof

A nano-conductive and light-curing technology, applied in ink, printed circuit manufacturing, application, etc., can solve the problems of high temperature resistance of substrate materials, high curing temperature of thermosetting resin, slow curing speed of thermosetting resin, etc., to achieve Effects of shortening sintering time, lowering sintering temperature, and improving resolution

Inactive Publication Date: 2010-08-04
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Properly adding thermosetting resin under the condition that the resistivity can meet the requirements can improve the mechanical properties of the conductive coating, but the curing speed of the thermosetting resin is slow, which is not conducive to improving the resolution of the PCB board.
At the same time, due to the high curing temperature of the thermosetting resin, the requirements for the high temperature resistance of the substrate material are strict.

Method used

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  • Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof
  • Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof
  • Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] First dissolve 5g nano silver powder (brand HDY, average particle size 43nm) in 12g ethanol and disperse ultrasonically for 20 minutes to a homogeneous solution, then add acrylic low viscosity resin EB81 under the condition of yellow light (filter out light with a wavelength less than 420nm) (100mPas, 25°C) 2g, butyl acrylate 1g, neopentyl glycol diacrylate 1g, trimethylolpropane triacrylate 0.45g, 1-hydroxycyclohexyl benzophenone 0.3g, dibenzoyl peroxide 0.1g, BYK0200.05g, BYK3730.05g, and p-hydroxyanisole 0.05g were stirred uniformly and then ultrasonically dispersed for 15 minutes to prepare a light-curable inkjet nano conductive ink with a viscosity (20°C) of 10mPa·s.

[0043] Use an inkjet printer to spray the prepared light-curable inkjet nano conductive ink on the surface of the glass substrate, expose it to a high-pressure mercury lamp (main wavelength of 365nm) for 2 minutes, and then sinter it on a controlled temperature hot stage at 180°C 10min, get the experime...

Embodiment 2

[0045] First, dissolve 5.5g nano silver powder (brand HDY, average particle size 43nm) in 15g ethyl acetate and disperse ultrasonically for 20 minutes to a homogeneous solution, and then add acrylates under the condition of yellow light (filtering out light with a wavelength less than 420nm) Viscosity resin viajet100 (100mPas, 25°C) 1.5g, N-vinylpyrrolidone 1g, neopentyl glycol diacrylate 1g, 6 ethoxytrimethylolpropane triacrylate 0.4g, 2-methyl 1-( 4-Methylmercaptophenyl)-2-morpholine 1-acetone 0.3g, dibenzoyl peroxide 0.15g, BYK0550.05g, BYK3730.05g, p-hydroxyanisole 0.05g, stir well and then ultrasonically disperse for 20 minutes Afterwards, a light-curable inkjet nano conductive ink was prepared with a viscosity (20°C) of 8 mPa·s.

[0046] Use an inkjet printer to spray the prepared light-curable inkjet nano conductive ink on the surface of the glass substrate, expose it to a high-pressure mercury lamp (main wavelength of 365nm) for 2 minutes, and then sinter it on a controll...

Embodiment 3

[0048] First, dissolve 6g nano silver powder (brand HDY, average particle size 43nm) in 20g ethyl acetate and disperse ultrasonically for 20 minutes to a homogeneous solution, and then add acrylate low viscosity under the condition of yellow light (filter out light with wavelength less than 420nm) Resin viajet100 (100mPas, 25°C) 1g, isooctyl acrylate 1g, ethoxy neopentyl glycol diacrylate 1g, 6 ethoxy trimethylolpropane triacrylate 0.4g, 2-hydroxy-2-methyl 0.3g of phenyl-1-phenylacetone, 0.15g of azobisisobutyronitrile, BYK0550.05g, Glide1000.05g, and p-hydroxyanisole 0.05g, stir uniformly, and ultrasonically disperse for 20 minutes to prepare photocurable inkjet nano Conductive ink, viscosity (20°C) is 6mPa·s.

[0049] Spray the prepared light-curable inkjet nano conductive ink on the surface of the polyester base with an inkjet printer, expose it to a high-pressure mercury lamp (main wavelength of 365nm) for 100s, and then place it on a controlled temperature hot stage at 150℃ ...

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Abstract

The invention relates to light-cured ink jet nanometer conductive printing ink for printed circuit boards, and preparation and use methods thereof. The preparation method comprises the following steps: an acrylic ester low viscosity resin and an acrylic ester active monomer are added into nanometer metal dispersing solution and the mixture adopts a double cured mode that the mixture is subjected to light cure firstly and heat treatment secondly, wherein the light-cured treatment ensures that a coat is cured rapidly and achieves good mechanical performance; and the heat treatment ensures that the nanometer metal is nodulized together to achieve good conductive performance. The light-cured ink jet nanometer conductive printing ink which adopts the ink jet technique can be painted in the specific area of a base material. A conductive path is obtained after the double cured treatment. The light-cured ink jet nanometer conductive printing ink has the advantages of short cured time, low cured temperature, good conductivity and high resolving capability. The manufactured conductive membrane has good adhesiveness, high hardness, good flexibility and excellent conductivity.

Description

Technical field: [0001] The invention relates to a light-curing inkjet nano conductive ink and a preparation method and use method thereof. Background technique: [0002] Traditional manufacturing methods of printed circuit boards (PCBs) include etching and screen printing. The etching manufacturing process includes substrate processing, glue coating, pre-baking, exposure, middle baking, developing, post-baking, and de-gluing. In the production process, many or even dozens of photolithography are often required, and the process is very complicated. At the same time, even if the mask is closely attached to the PCB board pre-coated with photosensitive resist material by vacuuming, there will still be gaps between the layers, resulting in diffraction during exposure, causing The image is distorted. Therefore, the resolution, alignment, and product yield of PCB boards made by etching methods are difficult to meet the requirements. Screen printing is to make conductive ink printed...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/10C09D7/12H05K3/14C09D11/52
Inventor 魏杰王玥
Owner BEIJING UNIV OF CHEM TECH
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