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Cleaning of electrostatic chucks using ultrasonic agitation and applied electric fields

An electrostatic chuck, ultrasonic technology, applied in the direction of using liquid cleaning methods, cleaning methods and utensils, chemical instruments and methods, etc., can solve the problems of increased separation time, separation failure, short life and so on

Active Publication Date: 2009-02-04
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

ESCs tend to exhibit shorter lifetimes leading to failures, for example, dynamic alignment failures, large leaks of helium cooling gas between the ESC and the underside of the supported substrate, increased detachment time and substrate sticking to the ESC or detachment failure
Early stages of ESC failure can lead to substrate breakage, impact yield, cause particulate and defect problems, and increase the cost of ownership of plasma processing equipment incorporating such ESCs

Method used

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  • Cleaning of electrostatic chucks using ultrasonic agitation and applied electric fields

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Embodiment

[0013] The cleaning processes provided below, which may be used to clean new and used ESCs, are illustrative and not limiting. To establish a baseline for determining the effectiveness of the cleaning process, two silicon wafers were electrostatically clamped on the ESC prior to cleaning without etching the wafers. This ESC was previously used to clamp the wafer during dielectric etch. Since the ESC is used, the ceramic surface of the ESC has been exposed to plasma. Consequently, the ceramic surface of the ESC is highly contaminated with contaminant particles that have to be removed by cleaning.

[0014] According to the figures, in order to reduce the amount of dielectric fluid used in the cleaning process, a plastic tank 10 may be placed within an ultrasonic tank 20 containing approximately 4.7 gallons of deionized water 30 so that there is Deionized water. The ultrasound box 20 is typically stainless steel and has an ultrasound transmitter 40 (its power supply not shown)...

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PUM

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Abstract

A method of cleaning an ESC comprises immersing a ceramic surface of the ESC in dielectric fluid; spacing the ceramic surface of the ESC apart from a conductive surface such that the dielectric fluid fills a gap between the ceramic surface of the ESC and the conductive surface; and subjecting the dielectric fluid to ultrasonic agitation while simultaneously applying voltage to the ESC.

Description

Background technique [0001] An electrostatic chuck (ESC), a component of semiconductor processing equipment such as a plasma etch chamber, that can be used for semiconductor wafers or glass substrates (i.e., flat-panel displays) during processing in, for example, chemical vapor deposition, physical vapor deposition, or etch reactors transmission, load carrying and / or temperature control. ESCs tend to exhibit shorter lifetimes leading to failures, for example, dynamic alignment failures, large leaks of helium cooling gas between the ESC and the underside of the supported substrate, increased detachment time and substrate sticking to the ESC or detachment failure . Early stages of ESC failure can lead to substrate breakage, impact yield, cause particle and defect problems, and increase the cost of ownership of plasma processing equipment incorporating such ESCs. Contents of the invention [0002] A method of cleaning an ESC is provided, comprising immersing a ceramic surface...

Claims

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Application Information

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IPC IPC(8): B08B3/12
CPCB08B3/12B08B7/00B08B3/00
Inventor 罗伯特·J·斯蒂格
Owner LAM RES CORP
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