Emulation design method and system for high speed interconnection system
A technology of high-speed interconnection and simulation design, applied in computing, instrumentation, electrical digital data processing, etc.
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[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention will be further described in detail below in conjunction with the embodiments and the accompanying drawings. Here, the exemplary embodiments and descriptions of the present invention are used to explain the present invention, but not to limit the present invention.
[0022] Here, in order to make the present invention easy to understand, some technical terms involved in the present invention are briefly introduced as follows:
[0023] The PCB board is generally composed of surface signal layers, such as the top signal layer and the bottom signal layer, the inner signal layer, the ground layer, and the dielectric layer. For example, it is composed of insulating materials, and the signal layers are connected by vias, such as figure 2 shown;
[0024] Transmission lines, copper wires used to carry electrical sign...
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