Emulation design method and system for high speed interconnection system

A technology of high-speed interconnection and simulation design, applied in computing, instrumentation, electrical digital data processing, etc.

Active Publication Date: 2009-03-25
RUIJIE NETWORKS CO LTD
View PDF0 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008]The main purpose of the present invention is to provide a new simulation design method for high-speed interconnection systems to solve the problems faced by traditional simulation methods

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Emulation design method and system for high speed interconnection system
  • Emulation design method and system for high speed interconnection system
  • Emulation design method and system for high speed interconnection system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention will be further described in detail below in conjunction with the embodiments and the accompanying drawings. Here, the exemplary embodiments and descriptions of the present invention are used to explain the present invention, but not to limit the present invention.

[0022] Here, in order to make the present invention easy to understand, some technical terms involved in the present invention are briefly introduced as follows:

[0023] The PCB board is generally composed of surface signal layers, such as the top signal layer and the bottom signal layer, the inner signal layer, the ground layer, and the dielectric layer. For example, it is composed of insulating materials, and the signal layers are connected by vias, such as figure 2 shown;

[0024] Transmission lines, copper wires used to carry electrical sign...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an emulation design method for a high-speed inter-connected system and the high-speed inter-connected system. The emulation design method comprises the following steps: determining parameters of components in the high-speed inter-connected system; calling S parameter base documents for the components according to the parameters of the components; building an integral model for the high-speed inter-connected system according to the topology combination mode of the high-speed inter-connected system and by using the called S parameter base documents; and emulating the high-speed inter-connected system by using the integral model of the high-speed inter-connected system and inducing emulation result. The emulation design method for the high-speed inter-connected system and the high-speed inter-connected system adopt a separate modeling mode according to the topology structure of a high-speed tandem system, and flexibly adopt proper emulators to emulatically calculate the components of the high-speed tandem system, so as to overcome the disadvantage of either long calculating time or low accuracy, which is caused by the fact that the same emulators have to be adopted in integral modeling in the prior high-speed tandem system.

Description

technical field [0001] The invention relates to the design of a high-speed interconnection signal channel in the communication field, in particular to a simulation design method of a high-speed interconnection system. Background technique [0002] At present, in the design of servers, storage devices, multimedia PC (Personal Computer—personal computer) systems and network communication systems, the parallel bus with shared characteristics is gradually replaced by the high-speed point-to-point serial bus. Some serial bus standard interfaces such as XAUI (10 Gigabit Attachment Unit Interface, 10G interface unit), PCI Express (Peripheral Component Interconnect Express, fast peripheral component interconnection standard), can provide signals from 1.25G to 10Gbps or even higher rate. These high-speed serial buses can not only provide high-speed transmission channels, but also save a lot of chip pins compared with parallel buses. [0003] However, these high-speed serial buses r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 彭泽林
Owner RUIJIE NETWORKS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap