Method for cleaning abnormal residual on wafer rear surface after Cu CMP procedure

A back surface, wafer technology, applied in the field of cleaning, can solve problems such as corroded metal, wafer damage, corrosion, etc., to achieve the effect of improving yield
CN101409209AInactive Publication Date: 2009-04-15SEMICON MFG INT (SHANGHAI) CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SEMICON MFG INT (SHANGHAI) CORP
Publication Date
2009-04-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a method for cleaning abnormal residue on the surface of a wafer after Cu CMP processing procedure. The method comprises the steps as follows: the wafer after the Cu CMP processing procedure is put into CTS-100 solution to be cleaned for removing impurity; the wafer is checked further before the next procedure, if the surface of the wafer has no the abnormal residue, the next procedure starts directly; if the surface of the wafer also has the abnormal residue, the wafer is put into cleaning solution with the pH value between 7 and 9 to be cleaned; and the cleaned wafer is processed for next procedure. The method can reduce the cleaning time of the wafer and improve the yield of the wafer.
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Description

technical field

[0001] The invention relates to a cleaning method, in particular to a method for cleaning abnormal particles on the surface of wafers in the field of photolithography after the Cu CMP process. Background technique

[0002] During the Cu manufacturing process of the wafer, after the wafer undergoes CMP (Chemical Mechanical Polishing, chemical mechanical polishing), many impurities, such as abrasives, abnormally small particles, etc., remain on the surface of the wafer, which requires cleaning fluid to remove Impurities. The current general practice is to clean the wafer in CTS-100 solution after grinding. Before the wafer enters the next process, the wafer needs to be inspected. If the wafer surface is clean and free of impurities, it can be directly entered In the next process, if there are particles on the surface of the wafer due to abnormal conditions, the product will be scrapped, and the next process cannot be entered immediately. At this time, the wafe...

Claims

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