Method for manufacturing flexible printed circuit board and detection method thereof

Abstract

The invention provides a manufacture method of flexible printed circuit boards and inspection method thereof. In the manufacture method of the invention, whether a circuit pattern is qualified is detected and open-circuit and short-circuit unqualified products are detected by an optical check process so that manufacturing processes can be reduced and the yield of subsequent handling is improved. In the inspection method of the invention, image data is with a unit of pixel and is measured in the direction vertical to the direction of measuring the circuit pattern or space width; if the measured width is bigger than the datum width, a short circuit is detected. If unqualified products that the measured width is bigger than the size of pixel are not detected, more detailed analysis of the circuit pattern or space brightness level is carried out in the vertical direction so that unqualified products corresponding to open circuit, short circuit or remain copper foil are detected. According to the invention, manufacturing processes may be simplified, the reliability of inspection process may be improved, and the production cost may be reduced, thereby being capable of possibly reducing the condition of no detection appearing in subsequent handling and improving the competitive power of manufacturing company.

Description

technical field [0001] The present invention relates to a semiconductor manufacturing process, and in particular to a method of manufacturing a flexible printed circuit board having an ultrafine circuit pattern and an inspection method for detecting an open circuit or a short circuit of the ultrafine circuit pattern. Background technique [0002] Along with the miniaturization, weight reduction and high functionality of electronic devices, printed circuit boards on which semiconductor elements are actually mounted are also gradually reduced in size and weight. Therefore, flexible printed circuit boards in tape or film form such as TAB and COF (Chip On Film) are often used in electronic devices. [0003] Recently, a display device uses a COF-type flexible printed circuit board for mounting a driver integrated circuit (Display Driver IC: DDIC). The width should be very fine. Therefore, in order to check defects in the manufacturing process, flexible printed circuit boards ge...

AI Technical Summary

Problems solved by technology

[0007] As mentioned above, recently, since a very fine circuit pattern is formed on a flexible printed circuit board for a driver integrated circuit of a display device, there are very fine defective products whose circuit pattern's open circuit / short width is, for example, about 2 μm or less, and the electrical inspection is reliable. decreased sex

In particular, the open circuit / short circuit width of the circuit pattern is very small. In the existing electrical inspection process of open circuit / short circuit, it is an over-inspection phenomenon that the actual qualified product is judged as a defective product or the actual defective product is judged as a non-conforming product. The non-detection phenomenon of qualified products increases geometrically, resulting in increased production costs, and cannot obtain stable inspection quality

Therefore, it has become the main reason for the reduction of the competitiveness of manufacturing companies.

Images