Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Abstract

A circuit connecting adhesive film is provided for connecting a first circuit member, in which a first circuit electrode is formed on the main plane of a first substrate, with a second circuit member, in which a second circuit electrode is formed on the main plane of a second substrate, in a status where the first and the second circuit electrodes are arranged to face each other. The film is provided with at least a conductive adhesive layer (3) containing conductive particles (1) and an adhesive (2); a first insulating adhesive layer (4) formed on one plane of the conductive adhesive layer (3); and a second insulating adhesive layer (5) formed on the conductive adhesive layer (3) on the plane opposite to the plane whereupon the first insulating adhesive layer (4) is formed. The thickness of at least one layer of the first and the second insulating adhesive layers (4, 5) is 0.1-5.0[mu]m.

Description

technical field [0001] The present invention relates to an adhesive film for circuit connection, a connection structure of circuit components, and a connection method of circuit components. More specifically, it relates to a circuit used for connection between circuit boards or electronic components such as IC chips and a wiring board. Adhesive film for connection, connection structure of circuit components using the same, and connection method of circuit components. Background technique [0002] When electrically connecting circuit boards or electronic components such as IC chips and circuit boards, anisotropic conductive adhesives in which conductive particles are dispersed in adhesives have been used. That is, the anisotropic conductive adhesive is disposed between the electrodes of the above-mentioned opposing circuit components, and the electrodes are connected by heating and pressing, so that the electrodes can be bonded in the pressing direction. While having electri...

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Problems solved by technology

[0004] However, in the above-mentioned conventional method, if the particle size of the conductive particles is reduced, the surface area of ​​the conductive particles is significantly increased, causing secondary aggregation of the particles to cause connection, and the problem that the insulation between adjacent electrodes cannot be maintained is likely to occur.

In addition, if the content of conductive particles is reduced, the number of conductive particles on the electrodes is also reduced and the number of contact points is insufficient, which is likely to cause the problem that the conduction between the electrodes that should be connected cannot be fully obtained.

In this way, if the conventional method is used, it is difficult to achieve high resolution of the circuit connection adhesive while maintaining long-term connection reliability.

[0005] In particular, due to the significant increase in resolution of circuit boards in recent years, that is, the miniaturization of the electrode area and the space between adjacent electrodes, the conductive particles on the electrodes are likely to flow out together with the adhesive due to heat and pressure during connection. Between adjacent electrodes, this situation hinders the high resolution of the adhesive for circuit connection

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