Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

A technology for circuit connection and circuit components, applied in the field of adhesive film for circuit connection, which can solve the problems of inability to maintain the insulation of adjacent electrodes, insufficient number of contact points, high resolution of difficult adhesives, etc., and achieve excellent long-term connection reliability, Excellent high resolution and excellent operability

Inactive Publication Date: 2009-04-29
HITACHI CHEM CO LTD
6 Cites 5 Cited by

AI-Extracted Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned conventional method, if the particle size of the conductive particles is reduced, the surface area of ​​the conductive particles is significantly increased, causing secondary aggregation of the particles to cause connection, and the problem that the insulation between adjacent electrodes cannot be maintained is likely to occur.
In addition, if the content of conductive particles is reduced, the number of conductive particles on the electrodes is also reduced and the number of contact points is insufficient, which is likely to cause the problem that the conduction between the electrodes that should be connec...
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Method used

[0042] In addition, FIG. 2 is a schematic cross-sectional view showing another suitable embodiment of the adhesive film for circuit connection of the present invention. The circuit connection adhesive film 110 shown in FIG. 2 is provided with: a conductive adhesive layer 3 containing conductive particles 1 and an adhesive 2; The thickness of the insulating adhesive layer 5 on both sides is in the range of 0.1 to 5.0 μm. Although not shown in Figures 1 and 2, on the surface of the adhesive film 100, 110 for circuit connection, there may be a detachable peelable base material (support film) to improve handleability or Prevent dust from attaching. Hereinafter, each layer which comprises the adhesive film 100 for circuit connections is demonstrated in detail using the adhesive film 100 for circuit connections shown in ...
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Abstract

A circuit connecting adhesive film is provided for connecting a first circuit member, in which a first circuit electrode is formed on the main plane of a first substrate, with a second circuit member, in which a second circuit electrode is formed on the main plane of a second substrate, in a status where the first and the second circuit electrodes are arranged to face each other. The film is provided with at least a conductive adhesive layer (3) containing conductive particles (1) and an adhesive (2); a first insulating adhesive layer (4) formed on one plane of the conductive adhesive layer (3); and a second insulating adhesive layer (5) formed on the conductive adhesive layer (3) on the plane opposite to the plane whereupon the first insulating adhesive layer (4) is formed. The thickness of at least one layer of the first and the second insulating adhesive layers (4, 5) is 0.1-5.0[mu]m.

Application Domain

Printed circuit assemblingSolid-state devices +6

Technology Topic

AdhesiveEngineering +2

Image

  • Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method
  • Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method
  • Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Examples

  • Experimental program(5)
  • Comparison scheme(3)
  • Effect test(1)

Example Embodiment

[0076] (Example 1)
[0077] 32 parts by mass of phenoxy resin (manufactured by Union Carbide, trade name: PKHC), 20% by mass of acrylic resin particles having an average particle diameter of 0.2 μm dispersed in bisphenol A epoxy resin ( Made by Nippon Shokubai Co., Ltd., trade name: BPA328) 10 parts by mass, bisphenol A type solid epoxy resin (manufactured by Petrochemical Shell Epoxy Co., Ltd., trade name: YL980) 20 parts by mass, imidazole-based curing agent (manufactured by Asahi Kasei Kogyo Co., Ltd.) , Trade name: NOVACURE HX-3941) 35 parts by mass and 3 parts by mass of a silane coupling agent (manufactured by Unika in Japan, trade name: A187), dissolved in toluene as a solvent to obtain insulation of 50% by mass of solid content Coating liquid for forming adhesive layer.
[0078] Next, using a coating device, the coating liquid was applied to a PET film with a thickness of 50 μm on one side (the side on which the coating liquid was applied) that was subjected to a mold release treatment, and dried with hot air at 70°C for 10 minutes. An insulating adhesive layer (a) having a thickness of 11 μm was formed on the PET film. The melt viscosity of the insulating adhesive layer (a) was measured using a viscoelasticity measuring device (manufactured by Rheometrics) under the conditions of a heating rate of 10°C/min, a stretching mode, a frequency of 10 Hz, and a temperature up to 25°C to 200°C As a result of the measurement, the melt viscosity at 120°C is 1.0×10 3 Pa·s.
[0079] Furthermore, using a coating device, the above-mentioned coating liquid for forming an insulating adhesive layer was coated on a PET film with a thickness of 25 μm on one side (the side where the coating liquid was applied) that was subjected to a mold release treatment at 70°C. Hot air drying was performed for 10 minutes to form an insulating adhesive layer (b) with a thickness of 2 μm on the PET film. The melt viscosity of the insulating adhesive layer (b) was measured using a viscoelasticity measuring device (manufactured by Rheometrics) under the conditions of a heating rate of 10°C/min, a stretching mode, a frequency of 10 Hz, and a temperature of 25°C to 200°C As a result of the measurement, the melt viscosity at 120°C is 1.0×10 3 Pa·s.
[0080] Next, 32 parts by mass of phenoxy resin (manufactured by Union Carbide, trade name: PKHC), 20% by mass of acrylic resin particles with an average particle diameter of 0.2 μm dispersed in bisphenol A epoxy resin containing acrylic particles Resin (manufactured by Nippon Shokubai Co., Ltd., brand name: BPA328) 20 parts by mass, imidazole-based curing agent (manufactured by Asahi Kasei Industry Co., Ltd., brand name: NOVACURE HX-3941), 35 parts by mass, silane coupling agent (manufactured by Unicard Japan, product Name: A187) 3 parts by mass and 30 parts by mass of silicone rubber (manufactured by Toray Dow Corning Corporation, trade name: E604) were dissolved in toluene as a solvent to prepare an adhesive solution with a solid content of 50% by mass. To 100 parts by mass of the adhesive solution, 20 parts by mass of conductive particles (average particle diameter: 3.2 μm) having an Au layer formed on the surface of a polystyrene core (diameter: 3 μm) were dispersed to obtain a conductive adhesive Coating liquid for forming adhesive layer.
[0081] Using a coating device, the coating solution was applied to a PET film with a thickness of 50μm on one side (the side where the coating solution was applied) that was subjected to a mold release process, and dried with hot air at 70°C for 10 minutes, so that the PET film A conductive adhesive layer (c) having a thickness of 10 μm is formed on the film. The melt viscosity of the conductive adhesive layer (c) was measured using a viscoelasticity measuring device (manufactured by Rheometrics) under the conditions of a heating rate of 10°C/min, a stretching mode, a frequency of 10 Hz, and a temperature up to 25°C to 200°C As a result of the measurement, the melt viscosity at 120°C is 1.0×10 4 Pa·s.
[0082] The insulating adhesive layer (a) and the conductive adhesive layer (c) obtained above were laminated with a roll laminator while heating at 40°C to obtain a laminated film. Next, on the conductive adhesive layer (c) side of the obtained laminated film, after peeling off the PET film on the conductive adhesive layer (c), the insulating adhesive layer (b) obtained above ), while heating at 40°C while laminating with a roll laminator, the insulating adhesive layer (a) has a thickness of 11 μm, the conductive adhesive layer (c) has a thickness of 10 μm, and the insulating adhesive layer (c) has a thickness of 10 μm. The adhesive layer (b) has a three-layered circuit connection adhesive film with a thickness of 2 μm.

Example Embodiment

[0083] (Example 2)
[0084]The thickness of the insulating adhesive layer (a) is 8 μm, the thickness of the insulating adhesive layer (b) is 5 μm, and the thickness of the conductive adhesive layer (c) is 10 μm. In the same manner as in Example 1, an adhesive film for circuit connection having a three-layer structure was obtained.

Example Embodiment

[0085] (Example 3)
[0086] The thickness of the insulating adhesive layer (a) is 12 μm, the thickness of the insulating adhesive layer (b) is 0.1 μm, and the thickness of the conductive adhesive layer (c) is 10 μm, except for In the same manner as in Example 1, an adhesive film for circuit connection with a three-layer structure was obtained.

PUM

PropertyMeasurementUnit
The average particle size0.2µm
Thickness11.0µm
Melt viscosity1000.0Pa·s

Description & Claims & Application Information

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