Soldered ball surface defect detection device and method based on machine vision

A defect detection and machine vision technology, applied in measurement devices, instruments, scientific instruments, etc., can solve the problems of ineffective detection of solder ball surface defects, affecting chip quality, and high false detection rate, and achieve accurate detection of solder ball surface defects. , the device structure is simple, the effect of strong classification ability
CN101424645AInactive Publication Date: 2009-05-06SHANGHAI JIAO TONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHANGHAI JIAO TONG UNIV
Publication Date
2009-05-06
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a device and a method based on machine vision for detecting the surface defects of solder balls in the field of automatic optical detection. An optical imaging system collects chip images, and an image collection system receives the collected chip images, intercepts a single-frame gray image from video stream signals output by the optical imaging system, and stores the single-frame gray image in the form of a two-dimensional integer matrix; an image segmentation module segments the whole two-dimensional integer matrix corresponding to the whole image into subsidiary matrices containing the solder balls, an image characteristic extraction module receives and processes the two-dimensional integer subsidiary matrices output by the mage segmentation module and outputs a one-dimensional floating point vector, and a probability neural network module receives, trains, and tests the one-dimensional floating point vector output by the image characteristic extraction module and divides the solder balls into two categories, namely good solder balls and defective solder balls. The device of the invention has simple structure, the graduation of a characteristic extraction method and a probability neural network is good, and the accuracy is high so as to realize the NDE (Non-Destructive Examination) of the surface defects of the solder balls.
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Description

Technical field

[0001] The invention relates to a detection device and method in the technical field of optical detection, in particular to a device and method for detecting solder ball surface defects based on machine vision. Background technique

[0002] With the development of chip production and packaging technology, the traditional solder pin-based chip production method has been unable to meet the requirements, replaced by solder ball-based surface mount technology, which is typically represented by ball grid array chip BGA. As an important connection part, the quality of the solder balls plays an important role in the quality of the chip. Due to the small size of solder balls, manual visual inspection is not only inefficient, but also has a high false detection rate. Therefore, numerous solder ball quality inspection devices and methods have emerged.

[0003] After searching the literature of the prior art, it was found that China Patent Publication No. CN101136346, publis...

Claims

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