H-shaped needle block
A needle block and top surface technology, applied in the field of needle blocks, can solve the problems of difficult implementation of the manufacturing process, poor electrical contact reliability, complex probe structure, etc., and achieve the effects of simple structure, improved reliability and low cost
Inactive Publication Date: 2009-05-13
徐承焕
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Problems solved by technology
[0007] However, due to the complex structure of the spring-inserted probe, the manufacturing process for manufacturing such a probe is difficult to implement and requires the use of components such as springs, thereby increasing the manufacturing cost
[0008] In addition, due to the presence of the operating unit for maintaining elasticity by means of springs, there is a high probability of manufacturing defective products in this operating unit and the reliability of the electrical contact is poor
Method used
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[0030] The present invention will be described more fully hereinafter with reference to the accompanying drawings that illustrate exemplary embodiments of the invention. First of all, the terms and expressions used in this specification and claims should not be regarded as limited to the general or literal meanings, and the inventors should use the principles for properly defining these terms and concepts in accordance with the principles of the present invention. To describe his / her own invention in the best possible way by explaining his / her own invention with meanings and concepts consistent with the spirit of the technology.
[0031] Therefore, the configurations shown in the embodiments of the present invention and the drawings are only the most exemplary embodiment examples, and do not represent all technical spirits of the present invention. Therefore, it should be understood that various equivalents and modifications that can replace these configurations may also exist...
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Abstract
The invention provides an H shape needle block comprising an upper needle block with an upper through hole which penetrates the upper needle block upper surface and the bottom surface in it, and an upper space part below the upper through hole; a lower needle block below the upper needle block with a lower through hole which penetrates the lower needle block upper surface and the bottom surface, and a lower through hole corresponding to the upper through hole and a lower space part on the lower through hole; and the H shape needle with the upper part inserting the upper through hole to enable the upper end protruding towards the upper needle block, and the lower part inserting in the lower through hole to enable the lower end protruding towards the bottom surface, and a bending part forming at the center the H shape needle to enable the H shape needle to have elasticity in the axial direction, wherein when the H shape needle is compressed in the axial direction, the bending part of the H shape needle generates elastic deformation in the upper space part and the lower space part. The work reliability of the H shape needle block is high and the cost is low. The H shape needle block can arrange a PCB assembly part or a semiconductor device in a right position and significantly improves the detection reliability.
Description
technical field [0001] The present invention relates to a pin block which electrically connects test contacts of a printed circuit board (PCB) assembly or a semiconductor device with contacts of a test device by pin contact to check the electrical properties of a PCB assembly or a semiconductor device Characteristics; More specifically, the present invention relates to an H-shaped needle block that does not use a general probe including a spring, but uses an H-shaped needle having a curved central portion. Background technique [0002] In general, a printed circuit board (PCB) assembly is an assembly in which a PCB in which a circuit line pattern is formed using a conductive material such as copper and miniature electronic parts are mounted on an electrically insulating substrate. Among them, the electrical characteristics of the PCB assembly and the mounted components are tested before they are mounted and assembled in small and light electronic products such as mobile phon...
Claims
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Login to View More IPC IPC(8): G01R1/067G01R31/00
CPCG01R1/073G01R31/2601
Inventor 徐承焕金善范崔卿隆
Owner 徐承焕