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Semiconductor cooling device

A cooling device and semiconductor technology, applied in semiconductor devices, output power conversion devices, cooling/ventilation/heating transformation, etc., can solve problems such as adverse effects of inverter circuits and semiconductor components

Inactive Publication Date: 2009-05-20
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, by shortening the wiring or using reciprocating wiring to reduce the assembly technology of the inductance component, the phase capacitor connected close to the semiconductor element is no longer necessary, so the single side of the heating block becomes a free space and the packaging density is reduced. Therefore, the semiconductor element that constitutes another power conversion device on the surface of the free space can increase the packing density, but there is a problem that if the semiconductor element is damaged, it will have a bad effect on the other undamaged semiconductor element.
[0020] Moreover, in the semiconductor cooling device installed in such a power supply unit, when the semiconductor element 201 constituting one inverter circuit is physically damaged, the remains of the damaged semiconductor element 201 will contact the other inverter circuit. semiconductor element 201, etc., and there is a possibility of adversely affecting another inverter circuit

Method used

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Embodiment Construction

[0065] Hereinafter, the present invention will be described in detail based on preferred embodiments shown in the drawings.

[0066] figure 1 It is an electrical circuit diagram according to Embodiment 1 of the present invention, and converts the DC power input to the DC terminals P1 and N1 into three-phase AC power and supplies it to the inverter circuit of each device (air conditioner, etc.) that is not shown in the figure, that is, power conversion. The device 30A; and the power conversion device 30B, which is an inverter circuit that converts the DC power input to the DC terminals P2 and N2 into three-phase AC power and supplies it to each device (air conditioner, etc.) not shown in the figure, are provided on the semiconductor element. Inside the cooling unit 4.

[0067] Among them, the power conversion device 30A is composed of a smoothing capacitor 3A connected to the DC terminals P1 and N1; a three-phase bridge whose DC side is connected to the DC terminals P1 and N1...

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Abstract

The invention provides a semiconductor cooling device, including a heat receiving block, where a first and a second semiconductor elements of two inverter circuits capable of running mutually independently, are provided on a first and a second element attaching planes; and a radiating portion connected to the heat receiving block, wherein the first and the second element attaching planes are arranged in a same plane.

Description

[0001] This application is a divisional application of an invention patent application with the application number 200580032603.9, the application date being October 18, 2005, and the invention title being "Power supply device for vehicles". technical field [0002] The present invention relates to a power supply device for a vehicle installed under the floor of a railway vehicle to supply electric power for driving the vehicle, and more particularly to a cooling device for cooling a semiconductor element group used in the power supply device. Background technique [0003] As a vehicle power supply unit installed under the floor of a railway vehicle, a Figure 26 The power conversion device shown. This power conversion device includes a semiconductor switching element (hereinafter simply referred to as a semiconductor element) 101 bridged by three phases, a phase capacitor 102 connected between AK (anode and cathode) of each phase, and a DC terminal PN connected to each other...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/00H02M7/48H05K7/20B61C17/00
CPCH01L2924/0002
Inventor 稻田靖之宫入正树
Owner KK TOSHIBA