Laminating wooden floor with prestress structure

A prestressed structure, laminated wood technology, applied in the field of floor manufacturing, can solve problems such as insufficient bending resistance and floor deformation, and achieve the effects of low cost, extended service life and good structural strength

Active Publication Date: 2009-06-24
DER FUTURE SCI & TECH HLDG GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies, and provide a laminated wooden floor with prestressed structure, which adopts a new concept, designs HDF prestressed structure technology, comprehensively improves the bending resistance of HDF, and completely solves the

Method used

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Example Embodiment

[0014] The present invention will be described in detail below in conjunction with the drawings: figure 1 As shown, the present invention is mainly composed of two upper and lower layers of medium density fiberboard 1 which are bonded at high pressure and low temperature to form a core layer, with a decorative surface layer 2 covering the upper surface and a balance material layer 3 underneath. At least one high-elasticity plastic component 4 in a three-dimensional structure is sandwiched between the upper and lower two layers of medium-density fiberboard 1, and the high-elasticity plastic component 4 is embedded in the inner side of at least one medium-density fiberboard 1. In the groove 5, see Figure 2. The medium density fiberboard 1 shown in FIG. 2 has longitudinal grooves 51 and transverse grooves 52 staggered on one side surface. As shown in FIG. 3, the high-elasticity plastic member 4 is a three-dimensional frame formed by longitudinal ribs 41 and transverse ribs 42, and th...

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Abstract

The invention provides a laminated wood floor of a prestressed structure. The floor is formed by bonding at least an upper medium-density fiber board and a lower medium-density fiber board at high pressure and low temperature. At least one spatially structured high-elasticity plastic component is clamped between the upper medium-density fiber board and the lower medium-density fiber board. The high-elasticity plastic component is embedded in a groove which is arranged in at least one medium-density fiber board; the high-elasticity plastic component is a spatially structured frame composed of a longitudinal rib and a horizontal rib, and the longitudinal rib and the horizontal rib form an radian which bulges upwards or downwards, and the high-elasticity plastic component is arranged between the upper medium-density fiber board and the lower medium-density fiber board to form a core board. The laminated wood floor has the advantages of good structural strength and stable structural properties, effectively ensures that the floor is not affected by environmental change during use, prolongs the service life, provides possibility of mass product processing, greatly saves wood resources, reduces the cost and the like.

Description

technical field [0001] The invention relates to a laminated wood floor, in particular to a wood floor with at least two upper and lower layers of medium-density fiberboards composited to form a core layer, and belongs to the technical field of floor manufacturing. Background technique [0002] In the prior art, the technology of using medium-density fiberboard (HDF) to produce floors through compounding is already a mature flooring manufacturing technology, but the composite flooring mainly made of medium-density fiberboard (HDF) still has bending resistance and The problem of poor elasticity, in order to overcome the problem of HDF bending resistance and poor elasticity, some structural technology is usually used to solve it. Now there are two known such technologies. One is the rib structure in the HDF plate. , the second is to sandwich wooden horizontal veneers between two HDF boards, that is, the sandwich structure. The core purpose of its technology is to enhance the be...

Claims

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Application Information

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IPC IPC(8): E04F15/02
Inventor 吴元新
Owner DER FUTURE SCI & TECH HLDG GRP CO LTD
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