Fast cooling method for high-power LED lamp

Abstract

The invention relates to a method for rapid heat dissipation of a high-power LED lamp. An internal radiator shutter (5) is arranged at the bottom part of a heat dissipation metal base (4), a liquid storage cavity (6) encircles the heat dissipation metal base (4) and the internal radiator shutter (5) and leaves certain space, a heat dissipation distribution cavity (8) is connected with the liquid storage cavity (6) and seals the whole cavity body, a radiator shutter (7) is arranged at the other side of the heat dissipation distribution cavity (8); when the high-power LED lamp works, the heat generated by an LED chip (1) is transmitted to the internal radiator shutter (5) through the heat dissipation metal base (4) to heat heat-conducting liquid in a heating vacuum cavity body, the heat-conducting liquid is rapidly vaporized in the vacuum and spread to the whole vacuum cavity body, thus greatly increasing heat dissipation area and speed thereof; as the size of the heat dissipation distribution cavity (8) and the radiator shutter (7) can be designed as required, the heat dissipation effect can be designed as required according to the power of the LED chip (1), namely the heat productivity of the LED chip (1) so as to achieve rapid heat dissipation.

Description

Technical field [0001] The invention relates to a high-power LED lamp. Background technique [0002] LED lights have many unique advantages: energy saving, environmental protection, safety, long life, low consumption, low heat, colored light, white light, high brightness, waterproof, miniature, shockproof, easy dimming, concentrated beam, easy maintenance, etc., are currently being vigorously promoted However, there are still some problems in the promotion of LED lights, one of the most important problems is the heat dissipation problem. The typical structure diagram of traditional high-power LED lamp is as follows: Figure 10 As shown, its structure is composed of LED chips (1), power supply pins (2), housing (3), heat dissipation metal base (4) and traditional heat sinks (12). Since the surface area of ​​high-power LED chips is very small Small size, high current density when working, severe heat inside the diode, a 25W Led chip, the bottom of a 25W Led chip has a metal s...

AI Technical Summary

Problems solved by technology

But why can’t we produce 100W high-power LEDs now? The reason is that cost considerations are a factor, but the inability to dissipate heat is one of the important reasons, so that this energy-saving product cannot be promoted well.

Images