Circuit board component installation/soldering quality inspection method and system based on super-resolution image reconstruction

Abstract

The invention relates to a circuit board component installation / soldering quality inspection method based on super-resolution image reconstruction. High-resolution images of the area to be inspected on the circuit board to determine whether the components are mounted and soldered satisfactorily. The detection system for implementing this method is composed of a central server and several super-resolution detection terminals. The central server is connected to each super-resolution detection terminal. After super-resolution reconstruction, it is sent to the central server. The central server matches the high-resolution image of the circuit board to-be-inspected area collected by each inspection point with the corresponding standard template to detect unqualified components or solder joints.

Description

technical field [0001] The invention relates to a method and system for detecting the production quality of circuit boards, in particular to a method and system for detecting the installation / welding quality of circuit board components based on super-resolution image reconstruction. Background technique [0002] With the development and wide application of electronic technology, the demand for electronic products is increasing, and the requirements for its manufacturing process are also getting higher and higher. For many electronic product manufacturers, how to accurately and efficiently detect and timely correct the quality problems in the production process of electronic products, reduce the defective rate, and ensure the quality of ex-factory products can not only save production costs, but also It directly affects the brand and reputation of the enterprise, is related to the survival of the enterprise, and is the core competitiveness of the enterprise. Among them, the ...

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Problems solved by technology

[0006] The purpose of the present invention is to provide a circuit board component installation / soldering quality inspection method based on super-resolution image reconstruction to solve the disadvantages of high cost and slow speed when reducing the area of ​​the shooting area when using high-resolution imaging equipment in the current automatic optical inspection , this method uses the camera array and the movement of the conveyor belt to perform super-resolution image reconstruction on the area to be inspected on the circuit board, and judges whether the components are installed and soldered according to the reconstructed high-resolution image of the area to be inspected on the circuit board

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