Semiconductor refrigeration air-conditioner suitable for oil smoke surroundings
A technology for air conditioning equipment and semiconductors, which is applied in air conditioning systems, lighting and heating equipment, space heating and ventilation, etc., to achieve the effects of simple structure, simple and reliable system, and convenient maintenance.
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Embodiment 1
[0012] in figure 1 In this embodiment, the semiconductor refrigeration and air-conditioning equipment suitable for the oily fume environment consists of a semiconductor refrigeration power supply 1, a bracket 2, an electric fan 3, a heat absorption plate 4, an insulation layer 5, a hot water absorption tank 6, a semiconductor refrigeration sheet 7, and a water inlet pipe. 8. The temperature sensor 9, the temperature display alarm 10, the water tap 11, and the water outlet pipe 12 are connected together.
[0013] The bracket 2 is fixedly connected with the electric fan 3 and the semiconductor refrigeration power supply 1 with screw fastening couplings. When in use, the bracket 2 is fixed on the wall of the kitchen with screw fastening couplings, or it can be fixed on the ceiling of the kitchen. The hot water absorption tank 6 is fixedly installed on the kitchen wall in the airflow direction of the electric fan 3 with screw fastening couplings. The hot water absorption tank 6 can al...
Embodiment 2
[0016] The vertical section of the hot water absorption tank 6 in this embodiment is a right-angled triangle, and the oblique side of the hot water absorption tank 6 is tightly pasted with the hot end surface of the semiconductor refrigeration sheet 7 with thermally conductive silica gel. The semiconductor refrigeration sheet 7 in this embodiment uses a ceramic flat plate with a power consumption of 120W There are 4 first-class semiconductor refrigeration fins, the heat absorption plate 4 is a flat structure, and the angle α between the windward surface of the heat absorption plate 4 and the horizontal plane is 30°. Other parts and the connection relationship of the parts are the same as in the first embodiment.
Embodiment 3
[0018] The vertical section of the hot water absorption tank 6 in this embodiment is a right-angled triangle, and the oblique side of the hot water absorption tank 6 is tightly pasted with the hot end surface of the semiconductor refrigeration sheet 7 with thermally conductive silica gel. The semiconductor refrigeration sheet 7 in this embodiment uses a ceramic flat plate with a power consumption of 120W There are 4 first-level semiconductor refrigeration fins, the heat-absorbing plate 4 is a flat structure, and the angle α between the windward surface of the heat-absorbing plate 4 and the horizontal plane is 60°. Other parts and the connection relationship of the parts are the same as in the first embodiment.
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