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Wafer support assembly

A technology for supporting components and supporting components, which is applied in ion implantation plating, metal material coating process, coating and other directions to ensure effective working time, ensure safety, and reduce waste.

Inactive Publication Date: 2011-04-06
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, sometimes the wafer deviates due to mechanical failure of the robot arm or abnormal pressure on the back of the wafer in the cavity. When the deviated wafer is placed on the support assembly from the robot arm, there is a possibility
[0006]The possible situation is as shown in Figure 2C. At this time, it is likely that one side of the wafer is placed on the support rod 62 of the support assembly, while the other side has been connected to the cooling table or support Table 8 contacts, and then the support assembly slowly moves downwards. Since one side of the wafer is already under a support rod, the support assembly moves downward to a certain extent and will hit the side of the wafer that contacts the cooling table or support table, causing the wafer to broken
Not only is a wafer wasted, but the tool needs to be cleaned because the broken wafer breaks the vacuum environment, and if the broken wafer is a multi-processed wafer, the loss is even more serious

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Fig. 3A is a schematic view of the working state of the wafer support assembly according to one embodiment of the present invention.

[0087] A specific manner of the wafer supporting assembly of the present invention includes: a base 71 , a supporting member 72 and a connecting member 73 .

[0088] Wherein, the base 71 is fixedly connected with the annular or circular base (not shown in the figure) of the machine, usually through the fixing hole 74 (as shown in Figure 3D) at the bottom of the base and the annular or circular base of the machine with nuts. The shaped base is fixedly connected so that the base can be raised and lowered together with the machine table. This part is the same as the prior art, so it will not be described in detail here.

[0089] The supporting member 72 includes a supporting end 721 , a connecting end 722 and a connecting hole 723 , as shown in FIG. 3B .

[0090] A slot is formed on the top of the base 71 for accommodating the connecting ...

Embodiment 2

[0096] In another case, the bottom of the groove is composed of two parts, bounded by the center of the connecting hole 713, or any bottom within the vertically corresponding bottom of the center of the connecting hole, divided into a horizontal bottom 712 and an inclined bottom 714, such as Shown in Figures 3E, 3F, and 3H. The horizontal bottom 712 can ensure that the support end 721 remains horizontal when there is no upward external force, or the component is in a natural state, that is, in a non-working state; while the inclined bottom 714 is inclined outward and downward, when the support end 721 is subjected to an upward external force Function, when the supporting end is rotated upwards, the slotted part formed by the inclined bottom can accommodate the connecting end side of the connecting part which is rotated downwards. Preferably, the inclination angle of the inclined bottom 714 relative to the horizontal bottom 712 is 35-60 degrees.

[0097] Other unexplained part...

Embodiment 3

[0099] As shown in Figure 3H, the connection holes 713 on the two side walls of the groove of the base 71 are elongated holes, preferably nearly elliptical elongated holes 711, the height of the holes matches the connection holes 723, and its length is consistent with the size of the wafer to be supported. change to match.

[0100] By adjusting the position of connecting parts, such as screws, pins, etc. inserted into the connecting holes in the long connecting hole 713 of the base, the distance between the supporting ends of each supporting part is adjusted to be suitable for supporting wafers of different sizes.

[0101] For example processing wafer is sometimes 200mm, sometimes when being 300mm, the length of the long hole is at least 50mm, so by moving the position of the screw in the connecting hole 713, the distance between the supporting ends can be adjusted so that it can be used for 200mm wafers and also can For 300mm wafers.

[0102] The length of the long connectio...

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PUM

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Abstract

A wafer supporting component is used in physical vapor deposition equipment. The component comprises a base and a supporting part; wherein, the base is fixed on an equipment pedestal and can go up and down with the equipment; the supporting part comprises a supporting end and a connecting end, the connecting end is connected with the base and supported by the base, and the supporting end is used to support the wafer. The wafer supporting component is characterized in that: the connecting end is flexibly connected with the base; when the supporting end is stressed by an upward external force, the supporting end can roll upwards surrounding the joint of the supporting end and the base; and when the supporting end is not stressed by an upward external force, the supporting end stays level. The component structure can ensure that the wafer is not damaged even if the wafer is offset.

Description

technical field [0001] This invention relates to equipment used in semiconductor manufacturing, and more particularly to wafer support assemblies used in physical vapor deposition equipment. [0002] Background technique [0003] In the physical vapor deposition process of semiconductor manufacturing process, Endura equipment is usually used, which includes several reaction chambers, transfer chambers, buffer chambers, loading chambers and manipulator walls. For example, as shown in FIG. 1 , there are two transfer chambers, respectively a first transfer chamber 2a and a second transfer chamber 2b, and each of the two transfer chambers has a robot arm 5a and 5b. Between the first transfer chamber 2a and the second transfer chamber 2b, there are two buffer chambers 3a and a cooling chamber 3b for temporarily placing and cooling wafers. The first robotic arm 5a in the first transfer chamber 2a is mainly used to transfer the wafer from the buffer chamber 3a to the reaction cham...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/50
Inventor 曾玉帆黎东明边逸军陈亮
Owner SEMICON MFG INT (SHANGHAI) CORP