Unlock instant, AI-driven research and patent intelligence for your innovation.

Direct liquid injector device

A liquid injector, direct technology, applied in coating, dissolution, chemical instruments and methods, which can solve problems such as different designs and no common basis

Inactive Publication Date: 2009-08-19
AVIZA TECHNOLOGY INC
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] As mentioned earlier, there are many existing systems that provide for the evaporation of liquid precursors that can be incorporated into an ALD system, but all of these systems are designed in a variety of ways and have no common basis, being individual components

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Direct liquid injector device
  • Direct liquid injector device
  • Direct liquid injector device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] refer to figure 1 , shows a perspective view of a single direct liquid injection (DLI) device 10 according to a first variant of the invention. As previously stated, the DLI apparatus of the present invention is typically incorporated in an atomic layer deposition (ALD) process associated with silicon wafer production, such as may be performed in a semiconductor processing chamber (not shown). As detailed below, the DLI evaporator assembly may also be employed in other applications, not limited to chemical vapor deposition (CVD), formation of high quality films, and other critical semiconductor and other related industrial applications.

[0051] combine figure 1 see figure 2 In the cross-sectional view of FIG. 1 , the device 10 is constructed on a tray base 12 having a generally planar configuration and capable of supporting components for vaporization and highly conductive delivery of liquid precursors. These components are mentioned here in general, mainly for the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A device for mixing, vaporizing and communicating a precursor element in a highly conductive fashion to a remote processing environment. A supply meter admits a precursor liquid according to a piezo controlled valve, which communicates therewith for controlling flow into a mixing manifold. A vaporizer manifold in cooperation with a carrier gas supply provides a carrier gas for contemporaneous delivery into the mixing manifold. A vaporizing component having at least a heating element in communication with the mixing manifold, in cooperation with a mixing (frit) material provided in the vaporizer body, causes a phase change of the liquid precursor into a vapor output. Delivery of the vapor outlet occurs along at least one high conductance run / vent valve located downstream from the vaporizing body, typically built into the vaporizer manifold architecture, and provides for metering of the vapor into a remote process chamber.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Application No. 60 / 774318, filed February 17, 2006, and U.S. Provisional Application No. 11 / 676346, filed February 19, 2007, the contents of which are incorporated herein by reference . technical field [0003] The present invention relates generally to precursor injection in semiconductor processing apparatus, and more particularly to a liquid precursor or precursor liquid solution injector for use, for example, in atomic layer deposition (ALD) of silicon wafers contained within corresponding process chambers. Background technique [0004] Atomic layer deposition (ALD) processing is the repeated, alternating exposure of a substrate to one or more individual gas-phase chemical precursors / reactants. Many precursors currently in use or just beginning to be used exist only in liquid or solid state. A physical characteristic shared by many of these precursors is low va...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B01F5/04C23C16/00
Inventor J·B·德杜特尼
Owner AVIZA TECHNOLOGY INC