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Curable epoxy resin-based adhesive compositions

A technology of epoxy resin and composition, which is applied in the direction of epoxy resin glue, adhesive type, natural rubber adhesive, etc., and can solve problems such as interference with curing adhesives

Active Publication Date: 2009-08-26
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the materials tend to interfere with the ability of the cured adhesive to bond strongly to oil-contaminated metal surfaces

Method used

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  • Curable epoxy resin-based adhesive compositions
  • Curable epoxy resin-based adhesive compositions
  • Curable epoxy resin-based adhesive compositions

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6

[0140] A series of adhesive compositions were prepared using the components listed in Table 1 (the amounts of each component are given in % by weight of the total composition), except that the amounts of the components used were the same in each example as follows:

[0141] 41.00% by weight Kaneka MX156 epoxy resin / core-shell rubber masterbatch (33% by weight core-shell rubber particles; Kaneka CO.);

[0142] 15.00% by weight epoxy resin / amine terminated polyether reaction product prepared according to US Patent No. 6,015,865;

[0143] 9.00% by weight Zeon F351 core-shell rubber particles (Nippon Zeon Chemicals);

[0144] 2.00% by weight Adeka Resin EP-49-10N (epoxy equivalent weight = 225; 100% solids; Asahi Denka Kogyo);

[0145] 3.00% by weight of a carboxylic anhydride / amine terminated polyether adduct, which is further reacted with an epoxy resin, prepared according to US Patent No. 6,884,854 or US Patent Application Publication No. US 2005-0215730;

[0146] 1.50% by we...

Embodiment 16

[0159] 2 DY965 CH polyurethane, believed to be prepared according to Example 16 of US Patent 5,278,257 (Huntsman Advanced Materials)

[0160] 3MESAMOLL Sulfonate Plasticizer (Bayer)

[0161] 4 tricresyl phosphate

[0162] 5 AMICURE CG1200 Dicyandiamide (Air Products)

Embodiment 7

[0164] Prepare an adhesive comprising the following components:

[0165] 53.66 wt% epoxy / core-shell masterbatch (Kaneka MX156, containing 25 wt% core-shell rubber particles; Kaneka Co.);

[0166] 15.00% by weight epoxy resin / amine terminated polyether reaction product prepared according to US Patent No. 6,015,865;

[0167] 9.00% by weight Zeon F351 core-shell rubber particles (Nippon Zeon Chemicals);

[0168] 4.00% by weight MESAMOLL sulfonate plasticizer (Bayer);

[0169] 2.00% by weight Adeka Resin EP-49-10N (epoxy equivalent weight = 225; 100% solids; Asahi Denka Kogyo);

[0170] 3.00% by weight of a carboxylic anhydride / amine-terminated polyether adduct, which is further reacted with an epoxy resin, prepared according to US Patent No. 6,884,854 or US Patent Application Publication No. US 2005-0215730;

[0171] 0.64% by weight WINGSTAY L antioxidant (Eliokem);

[0172] 1.50% by weight GARAMITE 1958 mixed mineral thixotrope (Southern Clay);

[0173] 1.00% by weight CARD...

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Abstract

This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.

Description

technical field [0001] The present invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive compositions having improved impact resistance and / or for oily metal based adhesives The adhesion of materials is improved. Background technique [0002] Briefly describe related technologies [0003] Many compositions and methods are disclosed in the art for making and using a wide variety of epoxy-based compositions and other resins and additives in an effort to improve expansion, impact resistance, and other critical properties of adhesives that Agents are used to bond, fill and construct composite structures. For example, patents disclosing components for formulating adhesives and using these compositions to bond various substrates to each other and to provide structural reinforcement include Patent Nos. US Patent 6,776,869 and US Patent Application Publication No. US 2005-0022929. [0004] For advanced structural b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C09J107/00
CPCC08L75/04C08L51/04C09J151/04C09J175/04C09J163/00C09J151/085C08L2666/02C08L2666/14C09J11/06
Inventor J-L·梁R·K·阿加瓦尔G·A·弗格森O·拉默斯乔普F·迪特里奇R·舍恩费尔德
Owner HENKEL KGAA
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