Method for manufacturing electroformed mold, method for manufacturing electroformed mold and electroformed part
A manufacturing method and technology of electroforming molds, which are applied in the field of mold manufacturing to achieve the effects of reducing thickness deviation, simplifying the process, and reducing the amount of grinding or grinding
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no. 1 approach
[0093] figure 1 It is a figure explaining the manufacturing method of the electroformed mold of 1st Embodiment of this invention in order of process, figure 1 (a) is a cross-sectional view showing a step of forming a first photoresist layer on a substrate and a step of exposing the first photoresist layer.
[0094] figure 1 In (a), the bottom conductive film 2 is formed on the top of the substrate 1, and then, the first photoresist layer 3 is formed on the top of the bottom conductive film 2, and then the first mask pattern 4a is aligned until it is formed as described later. The portion above the unexposed region of the soluble portion 3b is exposed by irradiating ultraviolet light 20a to divide and form the insoluble portion 3a as the exposed region and the accommodating portion 3b as the unexposed region.
[0095] The thickness of the substrate 1 is about 100 μm to 10 mm, as long as the strength of the electroformed mold 101 can be maintained in the electroforming proc...
no. 2 approach
[0137] Figure 6 It is a figure explaining the manufacturing method of the electroforming mold 102 which concerns on the 2nd Embodiment of this invention. In this second embodiment, the same reference numerals are assigned to the same components as those of the first embodiment, and description thereof will be omitted.
[0138] Figure 6 (a) is a cross-sectional view showing a step of forming a first photoresist layer on a substrate and a step of exposing the first photoresist layer in the second embodiment. As shown in the figure, first, a bottom conductive film 2 is formed on the substrate 1, then a first photoresist layer 3 is formed on the bottom conductive film 2, and then a portion where the soluble portion 3b is formed, The first mask pattern 4a is aligned and exposed by irradiating ultraviolet light 20a to divide and form the insoluble part 3a and the soluble part 3b. Here, a negative photoresist is used for the first photoresist layer 3 .
[0139] Figure 6 (b) i...
no. 3 approach
[0147] Figure 7 It is a figure which shows the manufacturing method of the electroforming mold 103 which concerns on the 3rd Embodiment of this invention. In this third embodiment, the same reference numerals are assigned to the same components as those of the first embodiment, and description thereof will be omitted.
[0148] Figure 7 (a) is a cross-sectional view showing a step of forming a first photoresist layer on a substrate and a step of exposing the first photoresist layer in the third embodiment. As shown in the figure, firstly, a bottom conductive film 2 is formed on the substrate 1, then a first photoresist layer 3 is formed on the bottom conductive film 2, and then the unexposed region to be the soluble portion 3b is formed. Above the part, the first mask pattern 4a is irradiated with ultraviolet light 20a for exposure, and the insoluble part 3a as the exposed area and the soluble part 3b as the unexposed area are divided and formed. In this embodiment, a nega...
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Abstract
Description
Claims
Application Information
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