White-light LED package structure with prefabricated fluorescent powder film and preparation method

Abstract

The invention provides a white-light LED package structure with a prefabricated fluorescent powder film, which consists of an optical lens 1, a fluorescent powder and caking agent prefabricated film lThe invention provides a white-light LED package structure with a prefabricated fluorescent powder film, which consists of an optical lens 1, a fluorescent powder and caking agent prefabricated film lct the chip directly, luminescence decay of the fluorescent powder caused by heating of the chip can be obviously reduced.ntact the chip directly, luminescence decay of the fluorescent powder caused by heating of the chip can be obviously reduced.ayer 2, a chip 5 and a support with a hollow center 6, wherein the fluorescent powder and caking agent prefabricated film layer 2 is glued on the plane of the optical lens 1; the chip 5 is arranged onayer 2, a chip 5 and a support with a hollow center 6, wherein the fluorescent powder and caking agent prefabricated film layer 2 is glued on the plane of the optical lens 1; the chip 5 is arranged on a central position on the bottom of the support with the hollow center 6; the optical lens 1 glued with the fluorescent powder and caking agent prefabricated film layer 2 and the support 6 are fixeda central position on the bottom of the support with the hollow center 6; the optical lens 1 glued with the fluorescent powder and caking agent prefabricated film layer 2 and the support 6 are fixedtogether; and the caking agent is filled in the middle clearance between the optical lens 1 and the support 6. A white-light LED manufactured by the package structure improves the light-emitting consitogether; and the caking agent is filled in the middle clearance between the optical lens 1 and the support 6. A white-light LED manufactured by the package structure improves the light-emitting consistency greatly, has stable optical parameters, shortens difference in the same batch or different batches greatly, and can improve the production efficiency. Because the fluorescent powder does not costency greatly, has stable optical parameters, shortens difference in the same batch or different batches greatly, and can improve the production efficiency. Because the fluorescent powder does not conta

Description

technical field [0001] The invention relates to a white light LED packaging structure and a preparation method thereof, belonging to the field of solid-state lighting. Background technique [0002] As a new type of solid light source, LED (Light Emitting Diode) develops rapidly because of its small size, fast response, good shock resistance, long life, especially energy saving and environmental protection. In recent years, it has been widely used in large-screen display, traffic signal lights, landscape lighting, street lighting and other fields. [0003] Due to technological development, the current mainstream white light LED manufacturing method is blue light chip + yellow phosphor powder. The specific process is: first fix the chip on the bracket and connect the circuit; After mixing the two, put them in a vacuum dryer to remove air bubbles (it takes at least 30 minutes), and then apply the mixture of phosphor and silica gel to the chip (also called dispensing), then he...

AI Technical Summary

Problems solved by technology

[0004] During the above-mentioned LED packaging process, there are three key problems in the phosphor powder coating: first, it is difficult to maintain a high degree of uniformity in the phosphor powder concentration from beginning to end, because the phosphor powder A certain particle size is maintained in the silica gel, and the phosphor has a certain weight, and its density is much higher than that of silica gel. Therefore, although the silica gel is relatively viscous, the phosphor will still slowly settle in it, and the time for degassing Longer, indirectly promotes the precipitation of phosphor powder, so when dispensing glue, the concentration of phosphor powder in the glue dispensed at the beginning is higher, and the concentration is lower as it goes, which leads to different batches or even the same The chromaticity of the LEDs manufactured in batches is not exactly the same. Finally, the factory must classify the manufactured LEDs according to parameters such as color error or color temperature.

; Second, the thickness of the dispensing glue on a single chip is difficult to be consistent. Since the glue dispensed by the dispensing machine is approximately spherical each time, the cured phosphor coating must be thick in the middle and thin around, and finally the LED is packaged. The light chromaticity must be inconsistent from the middle and the surroundings, the middle is yellowish, and the surroundings are blue; the third is the problem of luminous attenuation caused by the heating of the phosphor powder, because the current LED packaging process is to directly dispense the mixture of phosphor powder and silica gel to the chip. On the other hand, when the chip is working, it will emit a lot of heat, which will cause the temperature around the chip to rise rapidly. As a result, the luminous efficiency of the phosphor will continue to decline due to heat, which will directly affect the life of the LED.

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