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Process for producing microconfiguration transfer sheet and apparatus therefor

A manufacturing method and a manufacturing device technology, which are applied in the field of manufacturing micro-shape transfer sheets and manufacturing devices, can solve the problems of time-consuming, unsatisfactory, and unobtainable transfer accuracy, and achieve the effect of uniform pressure

Active Publication Date: 2012-07-18
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, since this method bends the pressing plate with springs of different elasticity, even if it is flattened by pressing with a press, the surface pressure of the forming surface will vary due to the high pressure of the protruding part, etc. This will lead to differences in transfer accuracy of fine shapes within the forming surface, and as a result, uniform transfer accuracy cannot be obtained.
In particular, the finer the surface shape, the more prominent the problem, and the thickness of the processed sheet obtained due to the difference in surface pressure distribution is also unsatisfactory.
Furthermore, when it is desired to change the amount of deformation, it takes time to change the position of the spring member and its support holder every time, so it is not practical.

Method used

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  • Process for producing microconfiguration transfer sheet and apparatus therefor
  • Process for producing microconfiguration transfer sheet and apparatus therefor
  • Process for producing microconfiguration transfer sheet and apparatus therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106] (1) Mold size: 500mm (film width direction)×800mm (film moving direction)×20mm (thickness).

[0107] (2) Mold material: copper.

[0108] (3) Fine shape: the pitch is 50 μm, the convex part is 25 μm wide, and the convex part is 50 μm high. The cross-sectional shape when viewed from the direction of film movement is rectangular.

[0109] (4) Pressurizing device: The maximum pressurizing pressure can reach 3000kN, and pressurizing is performed by hydraulic pump.

[0110] (5) The pressure device is equipped with two upper and lower aluminum alloy temperature control plates with a size of 700mm (film width direction)×1000mm (film moving direction), and each is connected to a heating device and a cooling device. The mold is installed on the temperature regulating plate on the lower side. The heating device is a heat medium circulation device, the heat medium is Baresam #400 (manufactured by Matsumura Oil Co.), and the heat medium heated to 150° C. flows at a flow rate of 100 L / min. ...

Embodiment 2

[0120] (1) Mold size: 500mm (film width direction)×800mm (film moving direction)×20mm (thickness).

[0121] (2) Mold material: copper.

[0122] (3) Fine shape: the pitch is 50 μm, the convex part is 25 μm wide, and the convex part is 50 μm high. The cross-sectional shape when viewed from the direction of film movement is rectangular.

[0123] (4) Pressurizing device: The maximum pressurizing pressure can reach 3000kN, and pressurizing is performed by hydraulic pump.

[0124] (5) The pressure device is equipped with two upper and lower aluminum alloy temperature control plates with a size of 700mm (film width direction)×1000mm (film moving direction), and each is connected to a heating device and a cooling device. The mold is installed on the temperature regulating plate on the lower side. The heating device is a heat medium circulation device, the heat medium is Baresam #400 (manufactured by Matsumura Oil Co.), and the heat medium heated to 150° C. flows at a flow rate of 100 L / min. ...

Embodiment 3

[0131] (1) Mold size: 500mm (film width direction)×800mm (film moving direction)×40mm (thickness).

[0132] (2) Mold material: copper.

[0133] (3) Fine shape: the pitch is 50 μm, the convex part is 25 μm wide, and the convex part is 50 μm high. The cross-sectional shape when viewed from the direction of film movement is rectangular.

[0134] (4) Pressurizing device: The maximum pressurizing pressure can reach 3000kN, and pressurizing is performed by hydraulic pump.

[0135] (5) The pressure device is equipped with two upper and lower aluminum alloy temperature control plates with a size of 700mm (film width direction)×1000mm (film moving direction), and each is connected to a heating device and a cooling device. The mold is installed on the temperature regulating plate on the lower side. The heating device is a heat medium circulation device, the heat medium is Baresam #400 (manufactured by Matsumura Oil Co.), and the heat medium heated to 150° C. flows at a flow rate of 100 L / min. ...

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Abstract

A process for producing a sheet and apparatus therefor that in the operation of heating a sheet substratum and a metal mold with fine uneven configuration, bringing them into mutual contact and pressuA process for producing a sheet and apparatus therefor that in the operation of heating a sheet substratum and a metal mold with fine uneven configuration, bringing them into mutual contact and pressurizing the same so as to form the fine uneven configuration on a surface of the sheet substratum, avoid transfer failure attributed to air trapping at the transfer face between the metal mold and therizing the same so as to form the fine uneven configuration on a surface of the sheet substratum, avoid transfer failure attributed to air trapping at the transfer face between the metal mold and thesheet substratum to thereby obtain a sheet having the desired fine uneven configuration formed on its surface. There are provided a process for producing a microconfiguration transfer sheet, and apparsheet substratum to thereby obtain a sheet having the desired fine uneven configuration formed on its surface. There are provided a process for producing a microconfiguration transfer sheet, and apparatus therefor, comprising, in the microconfiguration transfer sheet producing operation including heating a sheet substratum and a metal mold with fine uneven configuration, bringing them into mutualatus therefor, comprising, in the microconfiguration transfer sheet producing operation including heating a sheet substratum and a metal mold with fine uneven configuration, bringing them into mutualcontact and pressurizing the same so as to form the fine uneven configuration on a surface of the sheet substratum, carrying out the configuration formation while changing the planarity of a configuracontact and pressurizing the same so as to form the fine uneven configuration on a surface of the sheet substratum, carrying out the configuration formation while changing the planarity of a configuration forming face consisting of at least one, or a combination, of a pair of pressurization plates or metal molds arranged so as to apply pressure to the sheet substratum and the metal mold.tion forming face consisting of at least one, or a combination, of a pair of pressurization plates or metal molds arranged so as to apply pressure to the sheet substratum and the metal mold.

Description

Technical field [0001] The present invention relates to a method and apparatus for manufacturing a sheet having the fine three-dimensional shape on the surface by transferring the fine shape. Background technique [0002] As a method of forming fine concavities and convexities and other three-dimensional shapes on the surface of materials such as resin sheets, a method of transferring the three-dimensional shapes of concavities and convexities to the resin sheet by pressing the resin sheet and other materials with a heated mold with fine concavities and convexities It is already known (Patent Documents 1 to 2). [0003] However, when using this method to transfer and form fine shapes on a large-area resin sheet, there will be a problem that the transfer surface squeezes air between the mold and the processed sheet, and the fine three-dimensional shapes cannot be completely transferred. , The transfer effect is poor. [0004] This problem of squeezing in air can occur in the case of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C59/02B29C33/40B29C43/36
CPCB29C2059/023B29C33/08B29C43/021B29C43/003B29C2043/025B29C59/022B29K2105/256B29C43/00B29C43/36B29C33/40B29C59/02
Inventor 千木良宣嗣箕浦洁野村文保
Owner TORAY IND INC
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