Boundary scanning chip failure detection device and method

A fault detection and boundary scan technology, applied in measurement devices, measurement of electricity, measurement of electrical variables, etc., can solve the problems of inaccurate fault location and difficult detection, and achieve the effect of improving work efficiency
CN101526581AInactive Publication Date: 2009-09-09MITAC COMP (SHUN DE) LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
MITAC COMP (SHUN DE) LTD
Publication Date
2009-09-09
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention discloses a boundary scanning chip failure detection device and a method. A test interface connected to a detected chip by an application program fully detects the detected chip. The device comprises an application program module, a receiving and analyzing feedback information unit and a display module, wherein the application program module is provided with a vector sending unit which can send a test vector to the detected chip and detect a detected main board; the receiving and analyzing feedback information unit receives the feedback information of the detected chip and acquires the detection results through analyzing the feedback information; and the display module displays the detection results acquired by analyzing the feedback information through the application program module. The method comprises the following steps: a, sending the test vector to the detected chip; b, receiving and analyzing the feedback information of the detected chip; and c, displaying the detection results acquired by analyzing the feedback information. The device and the method achieve full detection of the detected chip, and can successfully detect question points of the detected chip and accurately position; and the test is more convenient.
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Description

technical field

[0001] The present invention relates to a fault detection device and method, in particular to a boundary scan chip fault detection device and method. Background technique

[0002] The detection of faults on the circuit board is usually carried out by using traditional detection equipment such as probes and needle beds. With the development of integrated circuits into the era of VLSI, the high complexity of circuit boards and multi-layer printed boards, surface mount (SMT), ball grid array (BGA), wafer scale integration (WSI) and multi-chip modules The application of (MCM) technology in the circuit system makes the physical accessibility of circuit nodes gradually weakened or even disappears, and the testability of circuits and systems drops sharply. Due to the increasing integration of the circuit board, the distance between the nodes available for testing is getting smaller and smaller, and some even completely become recessive nodes. There are many disadv...

Claims

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