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Device and method for removing liquid from a surface of a disc-like article

一种物品、液体的技术，应用在半导体/固态器件制造、电气元件、电路等方向，能够解决无法清除液体等问题

Active Publication Date: 2009-09-23
LAM RES AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Current existing devices that are carefully designed to remove liquid from the interior area of ​​pan-shaped items do not adequately remove liquid from the exterior area
The design was once modified to adequately remove liquid from the outer area, but this design no longer adequately removes liquid from the inner area

Method used

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  • Device and method for removing liquid from a surface of a disc-like article
  • Device and method for removing liquid from a surface of a disc-like article
  • Device and method for removing liquid from a surface of a disc-like article

Examples

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Embodiment Construction

[0054] figure 1 A device 1 for removing liquid from the surface of a pan-shaped article W is shown according to a preferred embodiment of the invention. The device comprises a rotating chuck 2 for holding a disc-shaped article W and an arm 3 on which a nozzle assembly 4 is mounted. In this case, the disc-shaped article is a semiconductor wafer (wafer). The rotary chuck 2 can rotate (as shown by arrow R). Nozzle assembly 4 includes a plurality of nozzles with downward facing holes. Through these nozzles, different fluids are discharged towards the upward facing surface of the wafer. The arm 3 and nozzle assembly are connected to a motion mechanism (not shown) to move the nozzle assembly 4 across the surface of the wafer. The arm 3 can also move in a straight line (eg across a radius as indicated by arrow X), or can perform a rotational movement. As the nozzle assembly moves across the wafer, only a fixed distance a1 is maintained between the nozzle assembly and the wafer s...

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PUM

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Abstract

Herein disclosed is a method for removing liquid from a surface of a disc-like article comprising, rotating the disc-like article about an axis perpendicular to the disc-like article's main surface, supplying liquid onto the disc-like article when rotated, wherein the liquid is supplied from a supply port, which is moved across the substrate towards the edge of the disc-like article, supplying a first gas flow through a first gas supply port onto the disc-like article to an area, wherein the area has a centre having a distance to the centre of the rotational movement of not more than 20 mm, wherein the area, to which the first gas is supplied, is covered with a liquid layer when the first gas is supplied, and thereby opening the liquid layer at a discrete area, and supplying a second gas flow through a second gas supply port onto the disc-like article when rotated, wherein the second gas flow is supplied from a second gas supply port, which is moved across the substrate towards the edge of the substrate, wherein the distance of the second gas supply port to the centre is lower than the distance of the liquid supply port to the centre while the second gas flow and the liquid are supplied. Furthermore a device for carrying out the method is disclosed.

Description

technical field [0001] The present invention relates to a device for removing liquid from the surface of pan-shaped articles. More particularly, the present invention relates to an apparatus for removing liquid from the surface of a pan-shaped article by treating it with a fluid. Background technique [0002] Several liquid removal methods are known in the semiconductor industry. Many liquid removal methods employ a defined liquid / gas boundary layer, mostly known as Marangoni drying. [0003] 0001 US Patent No. 5,882,433 discloses a combined Marangoni rotary drying method and its device. Thus, deionized water was dispensed over the wafer, along with a mixture of nitrogen and 2-propanol. 2-propanol in nitrogen affects the liquid / gas boundary layer because of a surface slope which causes water to leave the wafer without leaving any water droplets on the wafer (Marangoni effect). The gas distributor always follows the liquid distributor as long as the liquid distributor mov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCH01L21/67034H01L21/67028H01L21/67051H01L21/00
Inventor H·克劳斯A·维特尔斯海姆
Owner LAM RES AG
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