Method for making a target assembly

Abstract

The invention provides a method for manufacturing a target assembly, wherein the method for manufacturing a target includes providing welding materials, the welding materials including a target blank and a back plate; comparing the hardness of the target blank and the back plate, and for welding with relatively high hardness The material is machined, the target blank is cleaned, and the back plate is cleaned; the target blank is fixed with a mold, and the target blank and the back plate are welded by diffusion welding to form a target assembly. The invention can reduce the preparation investment, the metal target blank such as aluminum or aluminum alloy will not be deformed during the preparation of the target assembly, and the manufactured target assembly is durable.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a manufacturing method of a target component. Background technique [0002] Physical vapor deposition (PVD) techniques, such as sputtering, are used in many fields to provide thin film material deposits with precisely controlled thicknesses with atomically smooth surfaces. During sputtering, a target in a chamber filled with an inert gas atmosphere is exposed to an electric field to create a plasma. The plasma in this plasma region collides with the surface of the sputtering target, thereby escaping atoms from the target surface. The voltage difference between the target and the substrate to be coated causes the escaped atoms to form the desired film on the surface of the substrate. [0003] Generally, the target assembly is composed of a target blank conforming to the sputtering performance and a back plate combined with the target and having a certain strength. The...

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Problems solved by technology

Moreover, the selection of target solder has very high requirements, such as strict requirements on parameters such as composition and purity, and the purchase price is expensive. Some even need to be purchased from abroad, and the procurement cycle is long.

Moreover, the target material soldered by solder is exposed to the air for a long time, and the solder in the solder layer is easy to oxidize.

[0006] However, using the known processing methods of diffusion welding targets, for relatively soft welding materials, such as aluminum or aluminum alloys, it is easy to cause deformation of aluminum or aluminum alloys in the process of preparing target components, resulting in complicated subsequent process steps.

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