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Heat dissipating device and heat transferring element thereof

A technology of heat transfer elements and heat dissipation fins, which is applied in the directions of electrical components, electrical solid devices, semiconductor devices, etc., can solve the problems of weakening structural strength, reducing heat conduction efficiency, deformation, etc.

Active Publication Date: 2011-05-04
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Please refer to figure 1 , in view of the demand for heat conduction efficiency of electronic equipment today, the vertical heat column 10 needs a base 11 with a larger area as the heat conduction surface, and meets the product conditions of "light and thin". However, due to the expansion of the conduction area, the base 11 is Under the condition of the same thickness, the structural strength of the base 11 when combined with the heat source F becomes weak, and deformation D is easy to occur. If the thickness of the base 11 is to be increased, the efficiency of heat conduction will be reduced.

Method used

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  • Heat dissipating device and heat transferring element thereof
  • Heat dissipating device and heat transferring element thereof
  • Heat dissipating device and heat transferring element thereof

Examples

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no. 1 example

[0028] Please also refer to figure 2 and image 3 , a heat transfer element 20 includes a body 21, a closed accommodating space is formed inside the body 21, a capillary structure 23 is arranged on the inner surface of the body 21 to form a continuous structure or a separate structure, and a capillary structure 23 with an opening 221 The inner ring 22 is arranged in the airtight accommodating space, and abuts against the upper and lower parts of the body 21 and the capillary structure 23. The body 21 also includes an outer ring 211 and a base 212, and the capillary structure 23 on the base 212 is more There is an annular depression 231 for the positioning of the inner ring 22 during assembly and after forming a finished product, so as not to lose the structural support effect due to deviation.

[0029] The capillary structure 23 on the inner wall of the body 21 is grooved, columnar, meshed or porous with metal powder particles, and the manufacturing method can be one of the ...

no. 2 example

[0033] Different from the first embodiment, the body 41 of the second embodiment is composed of an upper body 411 and a lower body 412 . A capillary structure 43 is arranged on the inner surface of the body 41, and an inner ring 42 with an opening 421 is arranged in the airtight accommodating space, and is connected with the capillary on the surface of the upper body 411 and the lower body 412 of the body 41. When the lower body 412 is in contact with the heat source, the working fluid will evaporate. Since the heat source is concentrated at the center of the lower body 412, the working fluid evaporated by absorbing heat energy can freely overflow to the upper body through the opening 421 of the inner ring 42 411 , the gas-phase working fluid can contact the upper body 411 and then cool down, and the cooled liquid-phase working fluid flows back to the lower body 412 by using the capillary structure 43 , so that the effect of reducing the temperature of the heat source can be ac...

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Abstract

The invention relates to a heat dissipating device comprising a plurality of heat dissipating fins and a heat transferring element, wherein the heat transferring element is connected with the heat dissipating fins and comprises a body and an inner ring, the body forms a sealing containing space, a capillary structure is arranged on the inner surface of the body, the inner ring is arranged in the sealing containing space and abutted with the body or the upper part and the lower part of the capillary structure, and the inner ring also comprises at least one opening.

Description

technical field [0001] The present invention relates to a heat dissipation device and its heat transfer element, in particular to a heat transfer element with high structural strength applied to a heat dissipation device. Background technique [0002] With the development of science and technology, the number of transistors per unit area of ​​electronic components is increasing, resulting in an increase in heat generation during use. Since the heat pipe is a simple but extremely effective heat dissipation device, it has been widely used in various electronic heat dissipation products. Its working principle is to transfer energy by the latent heat of the phase change between the gas and liquid phases of the working medium fluid. In the evaporation section (vaporization section), the working fluid takes away a large amount of heat energy from the heat source by means of the latent heat of evaporation. The capillary force provided by the capillary structure (wick) flows back ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04H05K7/20H01L23/427
Inventor 林祺逢游明辉
Owner DELTA ELECTRONICS INC