Circuit board and manufacture method thereof

Abstract

The invention discloses a circuit board which comprises a first dielectric layer, a first circuit layer, a second dielectric layer and a second circuit layer. The first dielectric layer is provided with a first surface and a second surface, wherein the first surface is provided with at least one groove. The first circuit layer is arranged on the inner wall of the groove. Furthermore, the second dielectric layer is arranged in the groove and covers the first circuit layer; the second circuit layer is arranged in the groove; and the second dielectric layer is positioned between the first circuit layer and the second circuit layer. The invention also discloses a manufacture method of the circuit board.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board with electromagnetic shielding effect and a manufacturing method thereof. Background technique [0002] Generally speaking, a circuit board for carrying or electrically connecting multiple electronic components is composed of a plurality of patterned conductive layers and a plurality of dielectric layers stacked alternately. Wherein, these patterned circuit layers are formed by defining and etching copper foil layers through photolithography. The dielectric layers are respectively disposed between two adjacent patterned circuit layers to isolate the patterned circuit layers. In addition, various electronic components (such as active components or passive components) can also be arranged on the surface of the circuit board, and the purpose of electrical signal propagation can be achieved through other lines inside the circuit board. However, a...

AI Technical Summary

Problems solved by technology

However, as the frequency of electrical signals transmitted by the line layer becomes higher and higher, the electromagnetic interference and noise between any two line layers will become more and more serious

Images