Heat-dissipation structure in closed box body and machining method thereof
A technology of heat dissipation structure and airtight box, applied in electric solid devices, semiconductor devices, cooling/ventilation/heating transformation, etc., can solve the problem of large thermal resistance of heat sink 1, poor circuit heat dissipation effect, and limited placement of ASIC chip 2 and other problems, to achieve the effect of simple product assembly, excellent heat dissipation effect, and excellent heat dissipation effect.
Inactive Publication Date: 2011-08-31
NEW H3C TECH CO LTD
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Problems solved by technology
The heat dissipation effect of this method is better than that of the first method, but the thermal resistance of the heat sink 1 is still relatively large, and it is greatly affected by the length and area of the heat sink 1. For ASIC chips 2 that are far away from the surrounding airtight box 4 The heat dissipation effect of the circuit is still not good
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[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0036] The invention provides a heat dissipation structure device in an airtight box, comprising: an airtight box, a printed circuit board, a device to be dissipated and a heat conducting film, wherein:
[0037] The printed circuit board, the device to be dissipated and the heat conduction film are located in the airtight box;
[0038] The printed circuit board is fixed on the box wall of the airtight box body;
[0039] The device to be dissipated is...
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The invention discloses a heat-dissipation structure in a closed box body. The heat-dissipation structure comprises a closed box body, a printed circuit board, a device to be radiated and a heat-conducting film. The printed circuit board, the device to be radiated and the heat-conducting film are positioned in the closed box body; the printed circuit board is fixedly arranged on a box wall of theclosed box body; the device to be radiated is fixedly arranged on one face of the printed circuit board, close to the box wall of the closed box body and in contact with the heat-conducting film; andthe heat-conducting film is arranged between the device to be radiated and the box wall of the closed box body, and the device to be radiated contacts the box wall of the closed box body. The invention further discloses a machining method of the heat-dissipation structure in the closed box body. The heat-dissipation structure and the machining method help simplify the design of a heat-dissipationscheme of the closed box body and realize good heat-dissipation effect.
Description
technical field [0001] The invention relates to the field of electronic equipment, in particular to a heat dissipation structure device in a closed box and a processing method thereof. Background technique [0002] The core of electronic products is composed of electronic circuits. Due to the emergence of highly integrated devices such as ASIC (Application Specific Integrated Circuit) chips, the density of electronic devices is getting higher and higher, and the power consumption per unit area is getting higher and higher. The bigger it is, the bigger the heat. The heat dissipation problem of electronic products is attracting more and more attention of designers. If the single-point temperature of some components in the whole electronic product is too high, it will easily lead to the failure of the component, and further lead to the failure of the whole machine. It may also cause serious accidents such as fire or personal injury. Therefore, general electronic products wil...
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IPC IPC(8): H05K7/20H05K3/34H01L23/34
Inventor 冯武通
Owner NEW H3C TECH CO LTD