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Embedded intelligent card matrix and manufacturing method thereof

A smart card base and manufacturing method technology, which is applied to recording carriers used in machines, instruments, computer parts, etc., can solve problems such as not meeting energy saving requirements and high energy consumption, and achieve easy control of product size, energy saving, and improved efficiency effect

Inactive Publication Date: 2009-11-18
北京大拙至诚科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Both of these two production processes are high-energy-consuming production processes. All smart card base manufacturers are large electricity consumers, which do not meet the energy-saving needs of the entire society

Method used

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  • Embedded intelligent card matrix and manufacturing method thereof
  • Embedded intelligent card matrix and manufacturing method thereof
  • Embedded intelligent card matrix and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] image 3 It is a structural schematic diagram of the mother card base of the mosaic smart card base of the present invention; Figure 4 It is an exploded schematic diagram of an embodiment of the mother card base of the embedded smart card base of the present invention; Figure 5 It is a three-dimensional schematic diagram of the mother card base structure of the mosaic smart card base of the present invention; Figure 5A Yes Figure 5 A partially enlarged schematic diagram. like image 3 , Figure 4 , Figure 5 , Figure 5A shown, and please also refer to the figure 2 , The mosaic smart card base 20 of the present invention includes a mother card base 21 and a small card base 22 arranged in the mother card base 21 and capable of being separated. The mother card base 21 is composed of more than one layer of paper base, and at least one packaging hole 210 is arranged on it. The small card base 22 is made of a high molecular polymer material, and its shape match...

Embodiment 2

[0082] Figure 6A It is a schematic front view of an embodiment of the small card base of the embedded smart card base of the present invention; Figure 6B Yes Figure 6A The schematic diagram of the top view; Figure 6C Yes Figure 6A side view diagram of Figure 6D Yes Figure 6C Partial enlarged schematic diagram of ; Figure 6E It is a schematic diagram of the small card base structure after partial sectioning.

[0083] like Figure 6A , Figure 6B , Figure 6C , Figure 6D and Figure 6E As shown, the difference between this embodiment and the above-mentioned embodiment 1 is mainly that, on the connection surface 220 connected with the outer periphery of the small card base 22 and the female card base 21, there is a middle part with the female card base 21. The grooves 221, 222 corresponding to the glue overflow port 2122 provided on the layer 212 can be embedded in the grooves 221, 222 after the hot melt glue in the pre-embedded capsule of the mother card base...

Embodiment 3

[0088] Figure 7 It is a structural schematic diagram of another embodiment of the mother card base of the mosaic smart card base of the present invention; Figure 8 It is a structural schematic diagram of another embodiment of the small card base of the embedded smart card base of the present invention; Figure 9 It is a schematic structural view of the small card base of the present invention embedded in the mother card base.

[0089] like Figure 7 , 8 , 9, the difference between this embodiment and the above-mentioned embodiment 1 is that at least one of the main card base 31 or the small card base 32 is provided with glue injection gaps 311, 321 on the top or bottom. In the illustration of this embodiment, only the situation where the glue injection gap is provided on the lower surface is shown.

[0090] like Figure 7 As shown, the glue injection gap can be provided only on one side of the mother card base 31, on the side of the packaging hole 310, and make one side...

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Abstract

The invention relates to an embedded intelligent card matrix and a manufacturing method thereof. The embedded intelligent card matrix comprises a master card matrix and a small card matrix which is arranged in the master card matrix and can be separated, wherein the master card matrix is formed by compounding more than one layer of paper and is provided with at least one encapsulation hole; and the small card matrix is made of a high molecular polymeric material, the shape of the small card matrix is matched with the encapsulation hole on the master card matrix, the small card matrix is embedded into the encapsulation hole, and the periphery of the small card matrix is connected with the master card matrix. The production cost of the intelligent card matrix is reduced, the pollution of wastes of the intelligent card matrix to the environment is furthest reduced, the efficiency is improved by 10 times compared with the current known injection molding production process, and the embedded intelligent card matrix and the manufacturing method thereof also have the advantages of high labor productivity, low defective rate and easy control of product size; and the production precision can reach the level of 0.01 millimeter, and the maximum allowable tolerance range is + / - 0.05 millimeter. The product fully accords with the standard requirement.

Description

technical field [0001] The present invention relates to an inlaid smart card base and a manufacturing method thereof. Background technique [0002] Smart card is a common and closely related card product in people's daily life, such as telecommunication card (GSM card, SIM card, CDMA card, etc.), bank card, transportation card, city card and other contact smart cards, which have become people's daily life. Indispensable items in life. For example, according to statistics, there is only one product of telecommunications cards, and China's production volume is about 800 million or more per year. [0003] like figure 1 shown, where, figure 1 It is a schematic diagram of the overall structure of a known contact smart card. As shown in the figure, the current contact smart card is composed of an integral card base 10 . For example, for a SIM card for a telecommunication mobile phone, the integral card base 10 includes a card basic body 11 , a card with a chip connected to the...

Claims

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Application Information

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IPC IPC(8): G06K19/077
Inventor 杨准韩晓奇李刚
Owner 北京大拙至诚科技发展有限公司
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