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Substrate holding apparatus

A substrate and equipment technology, applied in the field of substrate holding equipment, can solve the problems of reducing the bonding of the heating mechanism of the substrate holding mechanism, difficult to accurately and uniformly control the substrate temperature, unable to accurately and uniformly maintain the substrate temperature, and the like , to achieve the effect of controlling the substrate temperature

Active Publication Date: 2009-11-18
CANON ANELVA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Even with the above conventional techniques, it is difficult to control the substrate temperature precisely and uniformly
Especially, in a substrate holding device including a heating mechanism, thermal strain may occur upon heating and reduce adhesion between the substrate holding mechanism, the heat conducting member, and the heating mechanism
Thus, the substrate temperature cannot be maintained accurately and uniformly

Method used

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Embodiment Construction

[0027] Embodiments for carrying out the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments to be described below are merely examples for carrying out the present invention, and should be revised and modified when necessary depending on the arrangement of devices implementing the present invention and various conditions, and the present invention is not limited by the following embodiments.

【Arrangement of equipment】

[0028] will refer to figure 1 The general arrangement of the substrate holding apparatus 100 according to one embodiment of the present invention is illustrated. figure 1 is a view showing the arrangement of the substrate holding device according to this embodiment of the present invention. like figure 1 As shown in , the substrate holding apparatus 100 includes a substrate holding mechanism 105 for holding a substrate 103, a heating mechanism 133 arranged below the substrat...

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PUM

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Abstract

The invention relates to a substrate holding apparatus, comprising a substrate holding mechanism configured to hold a substrate; a heating mechanism; and a heat-conductive member which is interposed between the substrate holding mechanism and the heating mechanism to be in contact therewith and conducts heat generated by the heating mechanism to the substrate holding mechanism, wherein the heat-conductive member has a recessed section that opens to the substrate.

Description

technical field [0001] The present invention relates to a substrate holding device that uniformly controls the temperature of a substrate. Background technique [0002] In recent years, integration density has become high in semiconductor manufacturing. For high integrated circuit production rates, the substrate temperature must be controlled precisely and uniformly with good reproducibility. [0003] For example, in forming an aluminum (Al) thin film by sputtering, in order to embed Al in micropores, the treatment is performed at a temperature ranging from 400°C to 500°C. In order to bury Al in micropores without forming voids in this temperature range, precise and uniform temperature control is required. [0004] When forming a tungsten (W) film or a titanium nitride (TiN) film on a substrate by CVD, the process is performed at a temperature ranging from 300°C to 600°C. Also in this case, precise and uniform substrate temperature control is an important factor in determ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/00
CPCH01L21/68728H01L21/6831H01L21/67103Y10T279/23Y10T279/34H01L21/687
Inventor 金子一秋田中洋池田真义涩谷阳介
Owner CANON ANELVA CORP