Apparatus and method of temperature conrol during cleaving processes of thick film materials
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0035]The present invention relates generally to techniques including methods and apparatuses for manufacturing materials. More particularly, the present methods and apparatuses include a temperature control for cleaving free-standing thick films from material in bulk form, such as a silicon ingot. Such free-standing thick films are useful as a photovoltaic material such as a solar cell. But, it will be recognized that embodiments in accordance with the present invention have a wider range of applicability; it can also be applied to other types of applications such as for three-dimensional packaging of integrated semiconductor devices, photonic devices, piezoelectronic devices, flat panel displays, microelectromechanical systems (“MEMS”), nano-technology structures, sensors, actuators, integrated circuits, semiconductor substrate manufacturing, biological and biomedical devices, and the like.
[0036]As used herein, the term “bulk material” can refer to a predominantly homogenous piece...
PUM
Property | Measurement | Unit |
---|---|---|
Temperature | aaaaa | aaaaa |
Fraction | aaaaa | aaaaa |
Fraction | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com