Apparatus and method of temperature conrol during cleaving processes of thick film materials

Abstract

An apparatus for temperature control of manufacture of thick film materials includes a stage comprising a planar surface for supporting a bulk material to be implanted and subsequently cleaved. The bulk material has a surface region, a side region, and a bottom region which provides a volume of material and defines a length between the bottom region and the surface region. The apparatus further includes a mechanical clamp device adapted to engage the bottom region to the planar surface of the stage such that the bulk material is in physical contact with the planar surface for thermal energy to transfer through an interface region between the bulk material and the stage while the surface region is substantially exposed. Additionally, the apparatus includes a sensor device configured to measure a temperature value of the surface region and generate an input data. The apparatus further includes an implant device configured to perform implantation of a plurality of particles through one or more portions of the surface region of the bulk material and a controller configured to receive and process the input data to increase and/or decrease the temperature value of the surface region through at least the interface region between the planar surface of the stage and the bottom region of the bulk material.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The instant nonprovisional patent application claims priority to U.S. Provisional Patent Application No. 60 / 886,912, filed Jan. 26, 2007, and which is incorporated by reference in its entirety herein for all purposes.BACKGROUND OF THE INVENTION[0002]The present invention relates generally to techniques including methods and apparatuses for manufacturing materials. More particularly, the present methods and apparatuses include a temperature control for cleaving free-standing thick films from material in bulk form, such as a silicon ingot. Such free-standing thick films are useful as a photovoltaic material such as a solar cell. But, it will be recognized that embodiments in accordance with the present invention have a wider range of applicability; it can also be applied to other types of applications such as for three-dimensional packaging of integrated semiconductor devices, photonic devices, piezoelectronic devices, flat panel displays, m...

AI Technical Summary

Benefits of technology

[0014]According to certain embodiments, the bottom region of the bulk material opposite to the surface region, can be contacted thermally and mechanically through an adapter or interface plate. The bulk material could be secured to such an adapter plate using glue or other techniques, with an opposing face of the plate mounted onto the temperature controlled stage. Particular embodiments of the adapter plate can also allow for clamp mounting. In such an embodiment, the adapter plate with clamp mounting eliminates the requirement to clamp the bulk material directly,

Problems solved by technology

Unfortunately, such petroleum sources have become depleted and have lead to other problems.

Although effective, these solar cells still have many limitations.

These materials are often difficult to manufacture.

While these polysilicon plates may be formed in a cost effective manner, they do n

Images