Image sensor module package structure with supporting element

Abstract

An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a light-sensing area of a first surface thereof, first conducting pads electrically connected to the light-sensing elements, and a conducting channel passing through the chip and electrically connected to the first conducting pads at one end. The supporting element has an opening, a first coupling surface, and a second coupling surface. The opening corresponds to the light-sensing area and the first coupling surface is combined with the first surface of the chip while the light-transmitting element is combined with the second coupling surface. The supporting element separates the light-transmitting element from the chip by a proper distance, so as to enhance an image sensing accuracy of an image sensor module. The chip having the conducting channel effectively facilitates reducing an overall volume of the image sensor module package structure.

Description

technical field [0001] The present invention relates to an image sensing module packaging structure with a support, in particular to an image sensing module packaging structure that can improve the accuracy and sensitivity of image sensing, save wiring space, and can Reducing the packaging volume of the image sensing module packaging structure can also improve the production yield of the image sensing module packaging structure. The image sensing module packaging structure has a support. Background technique [0002] With the advent and popularization of various digital imaging products, the demand for image sensing modules used in digital imaging products such as digital cameras, mobile cameras, video phones, fingerprint readers, etc. is gradually increasing. . Generally speaking, according to the different light sensing elements used in the image sensing module, it can be mainly divided into a complementary metal oxide semiconductor image sensing module and a charge-coupl...

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Problems solved by technology

[0009] However, since only the transparent layer 11 is bonded to the chip 13 through the colloidal layer 12, there is only a very short distance between the transparent layer 11 and the photosensitive element 14, so imaging aberrations are likely to occur, thereby causing The light sensing element 14 cannot correctly sense the image

In addition, if there are defects or blemishes on the light-transmitting layer 11, they will be directly amplified, so that the image sensing module packaging structure 10 cannot accurately and sensitively sense images.

[0010] It can be seen that the above-mentioned existing image sensor module packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. Urgent problem

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