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Device and method for delivering material

A technology of conveying and adsorbing devices, applied in the direction of transportation and packaging, conveyors, conveyor objects, etc.

Inactive Publication Date: 2010-11-17
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that a transfer cycle includes the vertical lifting motion of the adsorption device relative to the loading tray, the horizontal reciprocating motion of the transfer mechanism relative to the guide rail and the vertical lifting motion of the adsorption device relative to the carrying surface of the conveyor belt. It takes a lot of time to adjust the speed of the adsorption device or the transfer mechanism in a timely manner when the adsorption device is moving vertically and when the transfer mechanism is moving back and forth horizontally, which is not conducive to improving production efficiency.

Method used

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  • Device and method for delivering material
  • Device and method for delivering material
  • Device and method for delivering material

Examples

Experimental program
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Embodiment Construction

[0015] The conveying device and the conveying method provided by the technical solution will be described in detail below in conjunction with the embodiments and accompanying drawings.

[0016] See figure 1 , The conveying device 100 provided by the first embodiment of the technical solution includes a frame 10 , a horizontal motion adsorption device 20 , a lifting device 30 , a conveyor belt 40 and a controller 50 .

[0017] The frame 10 includes at least one horizontally arranged guide rail and at least one support rod with one end perpendicular to the guide rail and the other end fixed to the ground. The structure of the frame 10, the number of guide rails and support rods depend on actual needs. In this embodiment, the rack 10 includes two guide rails 11 , four support rods 12 and connecting rods 13 . Wherein, the two guide rails 11 are parallel to each other and arranged horizontally. The connecting rod 13 is arranged between the two guide rails 11, and its two ends a...

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Abstract

The invention relates to a device for delivering materials, which comprises a stander, a horizontal movement adsorption device, a lifting device, a conveying belt and a controller. The stander comprises at least one horizontal guide rail. The lifting device is arranged under the guide rail and comprises a bearing device. The adsorption device is connected with the guide rail in a sliding mode, isopposite to the bearing device, comprises a sliding adsorption device and a second driving device connected with the sliding adsorption device and used for driving the sliding adsorption device to slide along the guide rail, and is used for transferring the materials in the bearing device to the conveying belt. The controller is connected with the sliding adsorption device, the second driving device and a first driving device, and is used for controlling the second driving device to drive the sliding adsorption device to adsorb the materials from the bearing device, slide between the lifting device and the conveying belt along the guide rail and throw the materials onto the conveying belt, and controlling the first driving device to drive the bearing device to lift relative to the guide rail.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a material conveying device and a material conveying method for conveying circuit boards. Background technique [0002] With the miniaturization and high-speed performance of electronic products, circuit boards have developed from single-sided boards to double-sided boards and multi-layer boards. Among them, double-sided circuit boards and multilayer circuit boards have more wiring area and higher assembly density and are widely used. See literature: Takahashi, A.; High density multilayerprinted circuit board for HITAC M-880; IEEE Trans. on Components, Packaging, and Manufacturing Technology; 1992. [0003] The production of multi-layer circuit boards includes inner layer circuit making, inner layer inspection, lamination, drilling, electroplating, making conductive lines, line electroplating, outer layer inspection, solder mask, surface processing and cutting molding. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46H05K13/00B65G47/91B65G15/00B65G47/04
Inventor 廖道明陈文村廖新治沈家弘李文钦
Owner AVARY HLDG (SHENZHEN) CO LTD