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Fastener and radiation device assembly using same

A technology of heat dissipation device and fastener, applied in the direction of elastic/clamping device, circuit arrangement on support structure, cooling/ventilation/heating transformation, etc. Effect

Inactive Publication Date: 2013-01-23
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the buckle is formed by bending a metal rod, the overall buckle has a linear structure
When the external force acts on the fastener, usually there is only a small contact area with the fastener, so in the fastening process, it is necessary to use a relatively large external force to act on the fastener so that the heat sink can be tightly attached to the electronics. On the components, it is laborious and time-consuming to operate

Method used

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  • Fastener and radiation device assembly using same
  • Fastener and radiation device assembly using same
  • Fastener and radiation device assembly using same

Examples

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Embodiment Construction

[0013] Figure 1 to Figure 4 A heat sink combination in a preferred embodiment of the present invention is disclosed, which is used to dissipate heat generated by electronic components (not shown) mounted on a circuit board 100. The heat sink combination includes a heat sink 10 and a heat sink 10 is fixed to a buckle 20 on the circuit board 100 and attached to the electronic components.

[0014] The heat sink 10 is integrally made of high thermal conductivity materials such as copper, aluminum or alloys thereof. The heat sink 10 includes a substantially rectangular bottom plate 12 and a plurality of cooling fins 14 vertically extending upward from the bottom plate 12 . The heat dissipation fins 14 are spaced apart from each other and parallel to a pair of longer sides of the base plate 12 , and a flow channel (not shown) for air flow is formed between each two adjacent heat dissipation fins 14 . A straight groove 18 is formed between two adjacent cooling fins 14a, 14b at the...

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PUM

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Abstract

The invention relates to a radiation device assembly used for radiating heating electronic elements on a circuit board, which comprises a radiator and a fastener. The radiator comprises a bottom plate and a plurality of radiation fins arranged on the bottom plate. A channel is formed between every two adjacent radiation fins. The fastener comprises a body contained in the channel and two fastening hooks connected with the two ends of the body and buckled with the circuit board. The body of the fastener comprises a pair of abutting parts abutting against the bottom plate. The tail end of each abutting part extends to form a fastening arm. The tail end of each fastening arm is bent to extend to form an operation part connected with the fastening hooks. The operation part is bent to form an operation face on which outer force acts. Each operation part is bent toward the direction away from the abutting part and is provided with an opening facing the abutting part. The abutting part is in a linear shape and the operation face of the operation part is used for receiving the application of an external force. Thus, the fastening arms are rotated with the abutting parts as the rotating shafts thereof, so as to be connected with or separated from the circuit board. Since the fastener of the radiation device assembly is provided with operation parts and operation faces on which the outer force acts, the touch area between the outer force and the fastener is increased. The radiation device assembly has the advantages of convenient operation, time saving and labor saving.

Description

technical field [0001] The invention relates to a buckle and a heat dissipation device combination using the buckle, in particular to a fastening labor-saving buckle and a heat dissipation device combination using the buckle. Background technique [0002] The commonly used combination of heat sinks for electronic components heat dissipation mainly includes a radiator and a fastener. The hooks between the side bumps of the circuit board, or the holes provided on the circuit board) are tightly pressed against the heat sink, so that the heat sink is tightly attached to the electronic components. Wherein, the buckle is formed by bending an elastic metal rod. In this design, the metal rod body has a horizontal pressing portion and arm portions that are bent and extended vertically from both ends of the pressing portion, and the pressing portion is pressed against the top of the radiator. A hook portion is extended from the end of each arm portion, and the heat sink is closely a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K7/12H01L23/40
CPCH01L2924/0002
Inventor 杜娟鲁翠军
Owner FU ZHUN PRECISION IND SHENZHEN