Fastener and radiation device assembly using same
A technology of heat dissipation device and fastener, applied in the direction of elastic/clamping device, circuit arrangement on support structure, cooling/ventilation/heating transformation, etc. Effect
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[0013] Figure 1 to Figure 4 A heat sink combination in a preferred embodiment of the present invention is disclosed, which is used to dissipate heat generated by electronic components (not shown) mounted on a circuit board 100. The heat sink combination includes a heat sink 10 and a heat sink 10 is fixed to a buckle 20 on the circuit board 100 and attached to the electronic components.
[0014] The heat sink 10 is integrally made of high thermal conductivity materials such as copper, aluminum or alloys thereof. The heat sink 10 includes a substantially rectangular bottom plate 12 and a plurality of cooling fins 14 vertically extending upward from the bottom plate 12 . The heat dissipation fins 14 are spaced apart from each other and parallel to a pair of longer sides of the base plate 12 , and a flow channel (not shown) for air flow is formed between each two adjacent heat dissipation fins 14 . A straight groove 18 is formed between two adjacent cooling fins 14a, 14b at the...
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