H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method
A technology of ag-cu-zn and liquid phase diffusion, applied in welding equipment, metal processing equipment, welding/welding/cutting items, etc., can solve the problem of large liquid phase, high eutectic temperature, and difficult control of fillet size, etc. problems, to achieve the effect of solving the connection and the excellent comprehensive performance of the weld
Active Publication Date: 2011-05-04
CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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Problems solved by technology
The traditional instantaneous liquid phase diffusion connection technology of copper alloy devices mostly uses Ag-Cu binary eutectic, which has a high temperature, a large amount of liquid phase, and the fillet size is not easy to control
Method used
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Embodiment 1
[0036] Example 1: Transient liquid phase diffusion bonding of H62 brass components
[0037] The parts of the pre-welded device are plated with silver first, the thickness of the plating layer is 6μm, the welding temperature is 780°C, the high-purity argon protection of 99.999%, the pressure is 0.02MPa, the welding holding time is 45min, the product weld structure photo is as follows figure 1 As shown, the device size and solder fillet detection meet the requirements.
Embodiment 2
[0038] Example 2: Transient liquid phase diffusion bonding of H62 brass components
[0039] The parts of the pre-welded device are plated with silver first, the plating thickness is 10μm, the welding temperature is 760°C, the high-purity argon protection of 99.999%, the pressure is 0.02MPa, the welding holding time is 60min, and the device size and solder fillet detection meet the requirements.
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Abstract
The invention relates to a H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method, which includes following steps: step one, trash extraction before workpiece welding; step two, interlayer preparing; presetting an Ag coating with a preset thickness of 4-10 mum on the copper alloy surface in a plating way; step three, welding process; putting the workpieces to be connected into abrazing furnace according to the required joint style, adopting the high purity inert gas shield, applying a balancing weight on the sample, heating and preventing heat at the temperature not exceeding Ag-Cu eutectic crystal, closing heating, sample furnace cooling to below 200 DEG C and taking out the sample, cooling to the room temperature in the air, finishing the connection. The invention effectively solves the connection of the copper alloy precision members with the device welding deformation smaller or equal to 0.02 mm, welding seam rounded corner R smaller or equal to 0.1 mm and excellent welding seam combination property.
Description
Technical field [0001] The invention relates to a transient liquid phase diffusion connection technology for copper alloy devices, in particular to an Ag-Cu-Zn liquid phase diffusion connection method for H62 copper alloy devices. Background technique [0002] With the continuous development of aerospace technology, the performance requirements of radars are further improved, requiring the radar to achieve precise tracking of targets; it can perform fine range-Doppler imaging and target recognition; it can measure the structure of complex targets; it is conducive to observation space. "Debris" type of small-sized targets, which is conducive to tracking the orbit of the spacecraft and ensuring the safety of the spacecraft. Millimeter wave radar has obvious advantages: it can realize ultra-low altitude detection and precise tracking of targets, has a series of advantages such as bandwidth, high resolution, strong anti-interference ability, small system size, light weight, high angu...
Claims
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IPC IPC(8): B23K1/008B23K1/20B23K103/12
Inventor 刘苏南冯展鹰刘洪斌冯吉才曹健
Owner CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST