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Light irradiation device

A light irradiation device and light irradiation technology, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of increased power consumption, decreased versatility, and increased operating costs, and achieved the effect of miniaturization

Inactive Publication Date: 2009-11-25
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the ultraviolet irradiation device described in Patent Document 1, the adhesive of the adhesive sheet is hardened by ultraviolet rays that pass through the entire bottom area, that is, it is irradiated all at once or on the entire surface. The illuminance of the part far from the light source has to use a high-output lamp, and the power consumption will increase with the enlargement of the device, and the running cost will increase.
Therefore, when the planar area of ​​the object to be irradiated is large, a lamp capable of irradiating ultraviolet rays over a wide area corresponding to it is required, which will become a major cause of decreased versatility.

Method used

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Embodiment Construction

[0021] Embodiments of the present invention will be described below with reference to the drawings.

[0022] figure 1 A schematic perspective view showing an embodiment in which the present invention is applied to an ultraviolet irradiation device, figure 2 showing a schematic front view with a portion cut away, image 3 show figure 2 sectional view of A. In these figures, an ultraviolet irradiation device 10 as a light irradiation device is configured to irradiate light (ultraviolet rays) to a wafer W to which a photoreactive (ultraviolet curable) adhesive sheet S is temporarily attached as an object to be irradiated. The ultraviolet irradiation device 10 includes: a housing 14 having an ultraviolet irradiation unit 11 disposed therein and an ultraviolet irradiation port 12; a sliding mechanism 15; a holding mechanism 16 for holding the wafer W; a pair of switch mechanisms 17 provided in the casing 14; a pair of force applying mechanisms for pressing these switch mechan...

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Abstract

The present invention discloses an ultraviolet irradiation device (10) which ultraviolizes a shone thing while taking a semiconductor chip (W) stuck with a ultraviolet constrictive type adhesive film (S), and the invention can move on a casing (14) when set collected in a sliding mechanism (15); the casing (14) is provided with a ultraviolet irradiation unit (11), and the adhesive film (S) is ultraviolized as irradiated surface when the sliding mechanism (15) moves in the direction bestrides an irradiation port (12) of the casing (14); the casing (14) is provided with a switch mechanism (17) which follows movement of the sliding mechanism (15) to open an irradiation port (12).

Description

technical field [0001] The invention relates to a light irradiation device, in particular to a light irradiation device capable of efficiently irradiating light to an object to be irradiated. Background technique [0002] In a semiconductor wafer (hereinafter, simply referred to as "wafer") processing equipment, for example, a protective adhesive sheet is attached to the circuit surface of the wafer, and then the back surface is polished, or a dicing tape is attached, and the wafer is diced into multiple pieces. Chip singulation process. The adhesive sheet used in such a treatment uses an ultraviolet curable (photoreactive) adhesive, and after the above-mentioned treatment, the adhesive force is weakened by curing the adhesive with an ultraviolet irradiation device, Wafer peeling can thus be easily performed without damaging the wafer. [0003] Patent Document 1 discloses such an ultraviolet irradiation device, for example. The ultraviolet irradiation device in this docum...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/268H01L21/78
CPCH01L21/304H01L21/6836
Inventor 竹内顺一
Owner LINTEC CORP