Radiating module and welding method thereof

Abstract

The invention relates to a radiating module and a welding method thereof. The radiating module comprises a pyrotube soaking plate, radiating fins and a frame, wherein the radiating fins are formed by buckling and connecting a plurality of fins and are welded on one surface of the pyrotube soaking plate; the pyrotube soaking plate is welded on the frame; and a locating hole is arranged on the frame. The welding method of the radiating module is as follows: coating tin cream on contact parts among the pyrotube soaking plate, the radiating fins and the frame; assembling the pyrotube soaking plate, the radiating fins and the frame; then putting the radiating module in a clamp, screwing the radiating module by a screw; next, putting the whole module and the clamp into a reflow oven for welding,and taking down the clamp after the welding of the whole module is finished. The radiating module is provided with the frame with the locating hole, thereby being directly and conveniently installedon a base of an electronic component; in addition, the radiating module is fixed by the clamp in the welding process, thereby preventing the tube expansion happening on the pyrotube soaking plate in the welding process.

Description

technical field [0001] The invention relates to a heat dissipation module and a welding method thereof, in particular to a heat dissipation module comprising a heat pipe type heat soaking plate, a cooling fin and a frame and a welding method thereof. Background technique [0002] With the continuous development of electronic technology, the operating frequency of electronic components is getting higher and higher, and the heat flux generated is also increasing. Therefore, electronic heat dissipation technology has also been highly valued by the industry. The heat generated in electronic components has the following remarkable characteristics: local heat flux density is high, heat flux distribution is uneven, high heat flux is confined to a small space, so-called hot spots are prone to occur, and power loss is prone to occur during the startup process of electronic equipment. It soars instantaneously, but the total heat that needs to be dissipated is not very large (the prosp...

AI Technical Summary

Problems solved by technology

However, the heat dissipation module has a serious problem of expansion of the vapor chamber during the welding process

In addition, it is difficult to install the heat dissipation module and electronic components together reliably, and it is very likely that the electronic components will be damaged due to overheating due to the dislocation of the heat dissipation module.

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