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Digital and analog mixed signal chip test card

A digital-analog hybrid and chip testing technology, applied in electronic circuit testing, electrical measuring, measuring devices, etc., can solve the problems of incapable of mixed-signal chip testing, high testing cost, etc., and achieve low testing cost, fast testing speed, and structural design. reasonable effect

Active Publication Date: 2009-12-02
天津津能易安泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing chip testing machines are usually only able to test single-type signal integrated circuit chips, but cannot effectively test mixed-signal chips, and the test cost is expensive

Method used

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  • Digital and analog mixed signal chip test card
  • Digital and analog mixed signal chip test card
  • Digital and analog mixed signal chip test card

Examples

Experimental program
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Embodiment Construction

[0022] Embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0023] A digital-analog mixed-signal chip test card, which is composed of a test card connected with a chip carrier board to be tested, the chip to be tested is inserted into a chip socket on the chip carrier board to be tested, and the chip test card can be inserted into a G5000 chip tester It can also be installed in the card slot of other general test equipment. The chip test card is equipped with a chip test circuit, such as figure 1 As shown, the chip test circuit is composed of an interface module, a configuration chip, an FPGA processing module, and an analog-to-digital conversion module. The interface module is connected to the FPGA processing module through a data bus, a control bus, and an address bus; the configuration chip is connected to the FPGA processing module. Above, the FPGA processing module is connected to the analog-to-di...

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PUM

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Abstract

The invention discloses a digital and analog mixed signal chip test card. A chip test circuit on the test card comprises an interface module, a configuration chip, an FPGA processing module and an analog-to-digital conversion module, the interface module is connected with the FPGA processing module through a bus, the FPGA processing module connected with the configuration chip is connected with the analog-to-digital conversion module and a tested chip carrier through a control end respectively, and is connected with the tested chip carrier through a digital signal output end, an analog signal output end of the tested chip carrier is connected with an input end of the analog-to-digital conversion module, a data clock signal and a state signal of the tested chip carrier are connected with the FPGA processing module respectively, a control end of the analog-to-digital conversion module is connected with the tested chip carrier, and an output end of the analog-to-digital conversion module is connected with a digital signal input end of the FPGA processing module. The test card has reasonable design, has the characteristics of steady performance, quick test speed, high efficiency, flexible and convenient use and the like, and realizes the test function for digital and analog mixed signal chips.

Description

technical field [0001] The invention belongs to the field of integrated circuit chip testing, in particular to a digital-analog mixed-signal chip test card. Background technique [0002] After designing and producing integrated circuit chips, integrated circuit design and manufacturers usually need to use a dedicated chip testing machine to test the integrated circuit chips to identify bad chips and mark them, so as to create conditions for the subsequent production process. Only by passing the test Integrated circuit chips can only be sold out of the factory, and integrated circuit chips that have not passed the test cannot be shipped. At present, domestic integrated circuit chip testing is mainly performed by integrated circuit chip manufacturers themselves and entrusted by professional test manufacturers to test. Due to the lack of testing capabilities of domestic chip manufacturers and the scarcity of professional testing manufacturers, chip testing has become a bottlen...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R31/3167
Inventor 刘华赵春莲姚琳张超华锡培
Owner 天津津能易安泰科技有限公司
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