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Manufacturing method of ceramic packaged sheet type quartz crystal frequency device

A manufacturing method, quartz crystal technology, applied in the direction of electrical components, impedance networks, etc., can solve the problems that affect the quality of finished products, the wafer cannot be positioned accurately, and the adhesive sticks to the wafer, so as to achieve airtightness without damage and improve The pass rate of the process and the effect of increasing the airtightness

Inactive Publication Date: 2012-07-25
上海晶赛电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. During mass production, during the process of dispensing and loading (placement of wafers), the wafers cannot be positioned precisely because they are operated on a plane; some wafers may be shifted or skewed after placement, resulting in a decrease in the pass rate of the process. Significantly decreased
[0006] 2. During large-scale packaging, sometimes the adhesive will leak from the junction of the upper cover and the lower cover and extend to the vicinity of the chip or even stick to the chip, thus affecting the quality of the finished product

Method used

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  • Manufacturing method of ceramic packaged sheet type quartz crystal frequency device
  • Manufacturing method of ceramic packaged sheet type quartz crystal frequency device
  • Manufacturing method of ceramic packaged sheet type quartz crystal frequency device

Examples

Experimental program
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Effect test

Embodiment 2

[0062] Such as image 3 As shown, in order to enlarge the vibration cavity, the upper cover plate of the frequency device is provided with an upper cover plate pit 4; the length and width of the upper cover plate pit 4 are greater than the length and width of the lower cover plate pit 5 .

[0063] Then, in the manufacturing method of this embodiment, step 1 further includes: making the upper cover plate 1 into a ceramic upper cover plate with m×n array pits by sandblasting;

Embodiment 3

[0065] In order to increase the vibration space below the wafer 3, the lower cover plate pit 5 of the quartz crystal frequency device of the present embodiment includes an upper pit 51 and a lower pit 52, and the length and width of the upper pit 51 are greater than that of the lower pit. The length and width of pit 52 (see Figure 4 ).

[0066] Then, in the manufacturing method of the chip quartz crystal frequency device of the ceramic package, the manufacturing of the lower cover plate 2 in the step 1 (2) includes forming a pit on the lower cover plate as the lower pit 52, and then forming an upper pit 52 again. Dimple 51 .

Embodiment 4

[0068] See Figure 5 , as an optimization scheme of embodiment 3, there are two protruding brackets 11 in the lower pit 52 of the chip quartz crystal frequency device of the ceramic package, and the height of the brackets 11 is less than the depth of the lower pit 52, and the brackets 11 The distance in the longitudinal direction is smaller than the length of the wafer 3 .

[0069] Then, during the preparation, the step 1 (2), in addition to all the steps included in Embodiment 3, also includes simultaneously forming two protruding brackets 11 in each lower recess 52 of the lower cover plate 2 .

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Abstract

The invention relates to a ceramic packaged sheet type quartz crystal frequency device and a manufacturing method thereof. The frequency device comprises an upper cover plate, a lower cover plate and a wafer, wherein the wafer is positioned in a concave pit of the lower cover plate, the length and width of the concave pit of the lower cover plate are greater than the length and width of the wafer, and the depth of the concave pit of the lower cover plate is greater than the thickness of the wafer; and the frequency device also comprises an inner electrode and an outer electrode. The manufacturing method comprises the following steps: firstly, manufacturing a lower ceramic cover plate with m*n array concave pits; secondly, dispensing conductive glue in the concave pits of the lower cover plate, bonding one end of the quartz wafer and the conductive glue and then fully dropping the quartz wafer in the concave pit of the lower cover plate, and bonding the wafers and the upper cover plateafter all positions in the concave pits of the lower cover plate are bonded with the wafers; thirdly, cutting a composite sheet into product units; and finally, leading out electrodes in the product units to form a monolithic sheet type device. The frequency device not only has simple structure, small size and good air tightness, but also is reliable; and the method for manufacturing the frequency device is not only simple, but also has low manufacturing cost and high efficiency.

Description

technical field [0001] The invention relates to a crystal frequency device and a manufacturing method thereof, in particular to a manufacturing method of a chip type quartz crystal frequency device packaged in ceramics. Background technique [0002] At present, quartz crystal frequency devices are widely used in communication, television, digital products, industrial automation and other fields to generate time-base oscillation frequency or select frequency. [0003] Quartz crystal frequency devices are made of the principle that quartz crystals will generate mechanical vibrations under the action of an alternating electric field. Therefore, it is not affected by external electromagnetic interference. In use, there is no need for complex shielding to prevent electromagnetic interference like other frequency components. It has quite positive significance to the miniaturization and integration of electronic products. [0004] Because the quartz crystal oscillator works thro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/19H03H9/02H03H3/02
Inventor 姚一滨
Owner 上海晶赛电子有限公司