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Method for corroding GPP chips with precedence order method

A chip and groove corrosion technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of long-term reliability of inconsistent terminal power devices, and achieve the goal of improving groove shape, reliability, and product qualification rate Effect

Active Publication Date: 2011-03-09
安徽钜芯半导体科技有限公司
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AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for corroding GPP chips with an optimal sequence method to solve the problem of long-term reliability of terminal power devices caused by inconsistencies in products during the GPP trenching corrosion process

Method used

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  • Method for corroding GPP chips with precedence order method
  • Method for corroding GPP chips with precedence order method
  • Method for corroding GPP chips with precedence order method

Examples

Experimental program
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Embodiment 1

[0016] Embodiment 1 (the acid solution that adopts, time)

[0017] First, pre-treat the chip: in an oven, heat up to 130°C, control the temperature at 125°C-135°C, pre-bake the chip for 15 minutes, until there is no water vapor on the chip surface, and then cool naturally to At room temperature, the role of pretreatment is to make the chip consistent in nature when it enters the acid bath.

[0018] The number of chips in each batch is 500 pieces, and 25 pieces of Teflon baskets are used for ditching, and two baskets (50 pieces) can be ditched in the acid tank at the same time. Therefore, each batch of chips is divided into 10 racks, and the first to tenth racks are marked in order frame, and mark the direction at the same time. The acid solution in the acid tank can be conventional ditching acid solution, such as: 5525 (that is, the mixed acid of 5 parts of hydrofluoric acid, 5 parts of nitric acid, 2 parts of glacial acetic acid, and 5 parts of sulfuric acid, the above is th...

Embodiment 2

[0030] Firstly, the chip is pretreated, and the method is the same as that in Embodiment 1.

[0031] The number of each batch of chips is 500 pieces, and 25 pieces of Teflon baskets are used for ditching, and two baskets (50 pieces) can be ditched at the same time in the acid tank, so each batch of chips is divided into 10 racks,

[0032] In the present embodiment, firstly, the chip of the first frame is ditched, at first, the direction mark is facing upwards for 8 minutes, and then the chip is turned 90 degrees, and the direction of the direction mark is ditching to the left for 10 minutes; After the ditch is completed, use the above method to ditch the second chip, and so on.

[0033] After the above-mentioned trenching is completed, measure the trench depth for all chips, and classify all chips according to the trench depth. The trench depth difference is 5um as a level, and then divide them into 10 racks, and put them into the acid tank and add trenches to the required dep...

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Abstract

The invention provides a method for corroding GPP chips with a precedence order method. The method comprises the following steps for corroding grooves: performing grooving and corroding by using a sequential method and a reverse sequence method alternately, and dividing the chips into N shelves in sequence; and grading all the chips by depth of the grooves, dividing the chip into M shelves, and putting the chips into an acid bath respectively to be grooved to a required depth. M and N are equal or not equal. By using a precedence order method which alternately uses the sequential method and the reverse sequence method and using a final step of grading and grooving, the method effectively solves the problem of inconsistent groove width and depth in the GPP product production due to corrosion capacity change resulting from corrosion liquid proportion change caused by the use of the sequential method and continuous corrosion in conventional grooving, and ensures GPP grooves can maintain uniform and even groove width and depth in the process of grooving and corroding, thereby improving product qualification rate in the process of production, groove shapes and the reliability of packedpower products.

Description

technical field [0001] The invention relates to a production process of a GPP chip, in particular to a trenching corrosion process of a GPP chip in the production process. Background technique [0002] GPP (Glass passivation powder) refers to the passivation of the surface of the chip with glass powder, which is used to protect the circuit of the chip. It first needs to draw a groove on the surface of the chip. The method of etching the groove can be used, and then coat the glass powder in the groove for passivation. [0003] The current GPP trenching etching process has the following disadvantages: During the etching process, as the number of times the etching solution corrodes the GPP chip increases, the proportion of the chemical components of the etching solution changes, and the corrosion ability of the etching solution becomes weaker. As a result, the shapes of the etched GPP grooves are inconsistent, which leads to the weakening of the conduction capacity and pressur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/306H01L21/00
Inventor 王坚红
Owner 安徽钜芯半导体科技有限公司
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